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Full-automatic lamination machine

A lamination machine, fully automatic technology, applied in the direction of layered products, lamination devices, lamination, etc., can solve the problems of low efficiency and high cost, reduce production costs, reduce dust hazards, and avoid base material stacking errors Effect

Active Publication Date: 2013-11-27
上海乾得智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problems of low efficiency, high cost and operation accuracy in manual superimposition of base materials in the existing base material processing process, and provides an efficient lamination machine

Method used

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Embodiment Construction

[0037] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0038] see figure 1 , which is a schematic diagram of the overall structure of the fully automatic lamination machine provided for this example. As can be seen from the figure, the stacker mainly includes a three-dimensional frame 100, a material suction device 200, a material retrieving device 300, a stacking and positioning mechanism 400, a stacking table 500 and a control mechanism (not shown in the figure), consisting of six parts.

[0039] The three-dimensional frame 100 is used to carry various base materials that need to be laminated. It can be seen from the figure that the entire three-dimensional frame 100 is a multi-layer three-dimensional structure distributed up and down, which includes a support frame 101 and several stacking layer...

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PUM

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Abstract

The present invention discloses a full-automatic lamination machine, which comprises a stereo rack, a material suction device, a material taking device, a material lamination position adjustment mechanism, a material lamination table and a control center, wherein the stereo rack comprises a plurality of material stacking layers, the material stacking layers are sequentially distributed from bottom to top, the material suction device sucks base materials on every material stacking layer and lifts the materials to corresponding material taking positions, the material taking device glidingly moves the base materials and sequentially laminates the materials to the material lamination position adjustment mechanism according to a lamination sequence, the material lamination position adjustment mechanism performs dislocation finishing on the plural layers of the laminated base materials according to process requirements, and directly places the finished base materials on the material lamination table, the material lamination table and the material lamination position adjustment mechanism are matchedly arranged, the material lamination table receives the plural layers of the base materials, and conveys the base materials to the subsequent processing steps, and the control device respectively forms controlled connections with the material suction device, the material taking device, the material lamination position adjustment mechanism and the material lamination table. With the full-automatic lamination machine, automatic base material lamination can be achieved, the lamination operation process can be precisely controlled, work efficiency can be substantially increased, and labor intensity can be reduced.

Description

technical field [0001] The invention relates to a multi-layer base material processing technology, in particular to a device for material stacking during processing. Background technique [0002] With the rapid development of science and technology and the continuous improvement of people's living standards, the demand for electronic products is increasing. At the same time, the upgrading cycle of electronic products is getting shorter and shorter. In various industries, the application of electronic products will become more and more extensive. . As the basis of printed circuit boards and electronic products, copper clad laminates will also maintain strong demand. [0003] Copper clad laminate is the basic material of the electronics industry, so it is often called the base material. It is mainly used for processing and manufacturing printed circuit boards (PCBs), and is widely used in televisions, radios, computers, computers, and mobile phones. [0004] The base materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00
Inventor 胡子健刘声强占得甜张益平
Owner 上海乾得智能科技有限公司
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