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How to use pins for semiconductor coating equipment with different heights

A kind of coating equipment and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of unequal pin height, achieve the effect of low precision parts, horizontal support, and good performance requirements

Active Publication Date: 2016-04-20
PIOTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of unequal pin heights at different support points in the prior art, and to provide a pin that can be used at each support point with the same structure but different heights. To achieve a highly consistent technical problem at each support point

Method used

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  • How to use pins for semiconductor coating equipment with different heights

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Embodiment

[0010] refer to figure 1 , The method of using pins for semiconductor coating equipment with different heights, the pins have multiple different heights. The height of the pin is set according to its reference value. Two height values ​​are set at the top and bottom respectively. According to the actual height, it is divided into 5 height values. The height value difference is set as the upper and lower height differences. 0.3mm range. The top surface 1 of the pin adopts a spherical structure, and this part is the part that is in direct contact with the wafer. Ensure that the pins and wafers are always in a tangential state, and there will be no adhesion due to external factors such as high temperature and process tests. The upper end portion 2 of the pin adopts a conical structure, which is more conducive to the smooth running of the pin when it contacts the heating plate during the lifting process. The main part 3 of the pin is a cylindrical structure, and it has a certai...

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Abstract

The invention discloses pins with different heights for a semiconductor coating device and a use method thereof, and mainly aims to solve the problem in the prior art that heights of pins at different supporting points are inconsistent. The plurality of pins with same structures but different heights are arranged at the supporting points to achieve the same height of the pins at the supporting points. In the invention, through switching among the pins with the different heights, the pins are enabled to be consistent in the height at the supporting points to ensure normal transmission of a wafer. An upper end portion of a pin main body is a cone structure, an upper end surface of the pin main body is a spherical structure; a transition zone is arranged between the upper end surface of the pin main body and the upper end portion of the pin main body; the transition zone and a joint section between an upper end of the transition zone and the pin main body are rounded structures; and a lower end surface of the pin main body is a hemispherical structure. In the method, in accordance with a pin height reference value, two height differences are respectively arranged over the pin height reference value and under the pin height reference value, i.e., the pins with five different heights can meet use requirements of devices. Compared with the prior art, the pins with the different heights of the invention is more reasonable, simple in structure and requires relatively low-precision parts.

Description

technical field [0001] The invention relates to a method for using pins for semiconductor coating equipment with different heights. To be precise, new pins with the same structure but different heights used to achieve the same purpose and thus simplify the operation belong to the technical field of semiconductor thin film deposition applications and manufacturing. Background technique [0002] The existing semiconductor coating equipment, especially the 12-inch semiconductor coating equipment, uses various forms of pins (Pin) to support and lift the wafer, but the requirements for the pins are the same, that is, during the transfer process of the wafer, During the lifting process of the pin lifting system, it must be ensured that the pins at each support point should be lifted smoothly, without any abnormal phenomena such as tilting and jamming. At the same time, it is also necessary to ensure that the height of the highest point of the pin at each support point is the same...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
Inventor 吴凤丽聂文远国建花
Owner PIOTECH CO LTD
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