Front opening wafer container with wafer cushion

The technology of a wafer container and buffer is applied in the field of front opening wafer container with wafer buffer to achieve the effect of reducing possibility and enhancing catchability

Active Publication Date: 2013-09-04
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This large sag presents a challenge in maintaining the desired spacing between wafers while still allowing automated wafer placement and removal by robotic arms

Method used

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  • Front opening wafer container with wafer cushion
  • Front opening wafer container with wafer cushion
  • Front opening wafer container with wafer cushion

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] refer to figure 1 , shows a front opening wafer container 20 that generally includes a container portion 22 having a front opening 24 defined by a door frame 28; and a front door 30 configured to close the front opening. The door has a pair of key holes 36 , 38 for accessing a latch mechanism 42 located inside a door housing 44 . The door has an outer surface 50 , a perimeter 54 and an inner surface 56 . Positioned on the perimeter is a slot 60 that allows the latch tab 64 or tip to extend and retract from the door to engage and disengage with a recess 70 on the inner surface of the door frame.

[0036] A recess 74 is centrally located on the inside of the door. Positioned within the recess is a plurality of wafer engaging portions 76 positioned to engage the vertically stacked spaced apart wafers positioned in the container portion 22 . The door has a seal or gasket 80 that engages and seals the door frame. The wafer engagement portion 76 includes a wafer cushion ...

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PUM

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Abstract

A front opening wafer container suitable for 450 mm wafers utilizes a wafer cushion on the front door with varying inclinations on the inside surface of a lower leg of V-shaped wafer cushion engagement portions on the door. Such provides enhanced performance. More specifically, in an embodiment of the invention, a front opening wafer container has, in cross section, horizontal V-shaped groove with the inside surface of the lower leg of the V having with at least two surface portions with different inclinations from horizontal. The surface portion adjacent the apex, where the edge of the wafer seats, has a lesser inclination from horizontal than a surface portion more distal from apex.

Description

[0001] related application [0002] This application claims priority to US Provisional Application No. 61 / 394,633, filed October 19, 2010, which is incorporated herein by reference. Background technique [0003] Integrated circuits such as computer chips are made from silicon wafers. Silicon wafers need to be kept in an extremely clean and contamination-free environment during their transport and between manufacturing process steps. Additionally, desired or desirable characteristics of containers for transporting and / or storing semiconductor wafers include light weight, rigidity, cleanliness, limited outgassing, and cost-effective manufacturability. When the container is closed, the container provides hermeticity or sealing to hermetically isolate the wafers. In short, such containers need to keep the wafers clean, uncontaminated, and undamaged. [0004] Plastic containers have been used for decades to transport and store wafers during and between processes. The selected p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673B65D85/38B65D85/86
CPCH01L21/67369H01L21/673B65D85/38B65D85/00H01L21/67386
Inventor 马修·A·富勒
Owner ENTEGRIS INC
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