Measurement system for thin-film material tension-compression fatigue dynamic loading

Abstract

The invention discloses a measurement system for thin-film material tension-compression fatigue dynamic loading. The measurement system comprises a dynamic loading device, wherein the dynamic loading device is placed on a three-dimensional precision translation stage below an optical microscope, and a CCD (Charge-Coupled Device) camera is installed at the upper end of an eyepiece of the optical microscope. According to the measurement system, a dual-system tensile device consisting of a stepping motor and piezoelectric ceramic can be used for realizing the integration of large displacement and high precision, and can be used for directly carrying out static and dynamic loading of a thin-film material and observing the surface morphology changes of the thin film in real time in the loading process so as to realize the non-contact local strain measurement. The measurement system is compact in structure and convenient to use.

Description

technical field [0001] The invention relates to a device suitable for static tension and compression loading and tension and compression fatigue dynamic loading and measurement of thin film materials, belonging to the technical fields of material mechanics, mechanical performance testing and photomechanics. Background technique [0002] With the development of micro-nano science and technology, the application of Micro-Electro-Mechanical System (MEMS) is becoming more and more extensive. Various thin films are the basic material form of MEMS, and are often made into micro-mechanical structures; thin films are widely used in industry. It also has a wide range of applications, such as oxidation resistance, anti-corrosion and improvement of mechanical properties for mechanical parts, building components or decorations. The performance of these thin films directly affects the reliability and life of the system, so it is very important to accurately and reliably test the mechanic...

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Problems solved by technology

The above-mentioned methods are aimed at metal thin film materials, and require the physical properties (elasticity, thermal expansion) of the substrate material and the thin film material to be significantly different before they can be tested, and the dynamic loading of the material is achieved through an indirect method. The frequency is not high enough to quantitatively describe the mechanical parameters of the material under dynamic loading

[0004] Yan Yongda of Harbin Institute of Technology invented the in-situ nano-tensile experiment measurement and detection device [Application No. 200810064383.3], which makes it possible to combine two independent processes of mechanical property measurement and microscopic shape detection, but its loading displacement accuracy is relatively low. Low, which is not conducive to the micro-nano loading test of the sample; Xie Huimin of Tsinghua University invented the dynamic tensile loading measurement system of low-dimensional materials [application number 200910131921.0], which realized the dynamic performance test of low-dimensional materials under high-frequency loading conditions. Piezoelectric ceramics are used as the driving element, the loading displacement range of this system is small, and it is impossible to realize high-precision and large displacement loading test

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