Cutting seedling raising method of peltate yam rhizome
A technology for raising seedlings by cuttings and Dioscorea Shield leaf, which is applied in the field of Dioscorea Shield leaf cutting and raising seedlings, can solve problems such as no public reports, etc., and achieve the effect of convenient operation.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0022] The technical solutions of the present invention will be further described in detail below in conjunction with specific embodiments.
[0023] 1. Select inserts
[0024] From mid-to-late June to mid-to-late September, cut the required branches in the morning to keep the branches moist and avoid wilting; trim the clipped branches into cuttings as soon as possible. The stem diameter of the cuttings is 1-2 mm and the length is 1-8 cm, with 1-2 intact leaves and at least one node;
[0025] 2. Cutting substrate
[0026] Build a small bow shed on the seedbed, and the cutting substrate is a 1:1 mixture of sand and vermiculite, with a thickness of 10 cm;
[0027] 3. Cutting and management
[0028] Insert the cuttings into the wet cutting substrate as soon as possible. When cutting horizontally, the branches are required to be embedded in the substrate for 1 to 6 cm, and the leaves are exposed to the air. The cutting density should be such that the leaves do not overlap each o...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com