Non-glue single face copper clad laminate with bonding function and manufacturing method thereof

A copper-clad substrate, single-sided technology, applied in the field of adhesive-free single-sided copper-clad substrate and its manufacturing, can solve the problems of poor appearance, high price of pure adhesive film, low yield, etc. Operation, dimensional stability, and the effect of improving production yield

Active Publication Date: 2013-07-10
SONGYANG ELECTRONICS MATERIAL KUSN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional production process of multi-layer boards or flexible circuit boards is to bond non-adhesive copper clad substrates with pure adhesive films for thermal compression bonding. This process is prone to bubbles or poor appearance during the process of attaching pure adhesive films. The yield rate is low, and the price of pure rubber film is relatively high

Method used

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  • Non-glue single face copper clad laminate with bonding function and manufacturing method thereof

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Embodiment

[0015] Embodiment: The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and characteristics of the present invention can be more easily understood by those skilled in the art, thereby making a clearer definition of the protection scope of the present invention .

[0016] An adhesive-free single-sided copper-clad substrate with pasting function, comprising an insulating base material 2 and a copper foil layer 1, the insulating base material 2 is formed on the lower surface of the copper foil layer 1, and the lower surface of the insulating base material 2 is An insulating adhesive layer 3 is formed on the surface, and a release layer 4 is attached to the lower surface of the insulating adhesive layer 3 .

[0017] Wherein, the insulating adhesive layer 3 is in a semi-fluid and semi-cured state (B-stage).

[0018] Wherein, the insulating substrate 2 is one of polyimide (PI) film...

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Abstract

The invention discloses a non-glue single face copper clad laminate with a bonding function and a manufacturing method thereof. After an insulation bonding glue layer is formed on the copper clad laminate, the convenient and efficient non-glue single face copper clad laminate with the bonding function is provided, the non-glue single face copper clad laminate and the insulation bonding glue layer are integrally formed, the non-glue single face copper clad laminate can be used by a customer conveniently, bonding and other operation processes of the customer are simplified, production processes and working hours of the customer are saved, and size stability is good. The insulation bonding glue layer is integrally formed on the non-glue single face copper clad laminate through coating baking, easily produced bubbles or a poor appearance in a traditional pure glue bonding process is avoided, production yield is improved, and production cost is reduced. The non-glue single face copper clad laminate with the bonding function is suitable for a multi-layer production technique and other FPC laminates needing the combination of non-glue base materials and pure glue.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to an adhesive-free single-sided copper-clad substrate and a manufacturing method thereof. Background technique [0002] Printed Circuit Board (PCB) and Flexible Copper Clad Laminate (FCCL) are important substrates for the manufacture of electronic communications, and as basic materials for electronic interconnection, they need to be thin, light and structured Features such as flexibility. With the development of electronic products towards miniaturization and high functionality, the demand for miniaturization of circuit spacing is increasing day by day, such as folding mobile phones, digital cameras, digital video cameras, automotive satellite positioning devices, LCD TVs, notebook computers, IC substrates, etc. With the emphasis on high-performance, high-speed transmission, and light-weight and thin requirements, the required substrates are also developing toward...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03B32B15/08B32B15/20B32B7/12
Inventor 陈晓强徐玮鸿周文贤
Owner SONGYANG ELECTRONICS MATERIAL KUSN
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