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Granular powder

A technology of granule powder and wheat flour, applied in the field of granule powder, to achieve the effect of good operability and good adhesion

Active Publication Date: 2013-07-03
NISSHIN DCA FOODS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the food obtained from the raw material powder to which only dextrin was added showed a sticky thick texture

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～2

[0042] The raw materials containing wheat flour (thin flour) and dextrin (DE value: 12) shown in Table 1 were charged into the device described in JP-A-2009-34038, and 10% of the total amount of wheat flour and dextrin was added water, and then perform a moist heat treatment for 5 seconds under the conditions of a gauge pressure of 25 kPa and a temperature of 105°C. Drying and cooling after wet heat treatment, passing through a 26 mesh or 30 mesh sieve to prepare an average particle size of 80 mu m (Example 1) and 180 mu The granular powder of m (embodiment 2).

Embodiment 3～5

[0066] According to the same steps as in Example 1, the raw materials containing wheat flour (thin flour) and dextrin (DE value: 12) shown in Table 6 are used to prepare granular powder (average particle diameter is 80 mu m).

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Abstract

Provided is a wheat flour-containing granular powder for food, having good adhesion when sprinkled on foodstuff, having good handling with no scattering of powder dust, which provides both a fluffy and soft texture internally and a crispy surface texture, and is capable of maintaining good texture even if time has passed since being cooked. The granular powder comprises wheat flour and dextrin that have been hydrothermically treated.

Description

technical field [0001] The present invention relates to granular powder, and more specifically, to fried foods such as tempura (天ぷら), deep-fried food (フライ), dry-fried food (から扬げ), miscellaneous okonomiyaki, and pancakes (Hotto). ケーキ), baked foods and other baked foods, steamed foods, sauces, binders (つなぎ) and other food granules containing wheat flour. Background technique [0002] Fried food such as tempura, fried food, dry fried food, etc. are coated with wheat flour, starch, condiments, etc. directly or in the form of butter batter (batter liquid) directly or in the state of the ingredients. On the ingredients, and then deep-fried to manufacture, but requires adhesion on the ingredients, uniform fried color, crunchy texture, etc. In addition, for baked foods such as okonomiyaki, pancakes, and baked goods, various raw materials (raw grounds) are required, such as a crispy, delicious surface with a bite, and a soft and sticky content. As other wheat flour-containing foods,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A23L1/176A23L7/10A23L7/157
CPCA23P10/20A23P20/12A23L29/35A23L7/198A23L7/157
Inventor 吉冈育之近藤真人
Owner NISSHIN DCA FOODS INC
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