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Substrate plating apparatus and substrate plating control method

A technology of electroplating equipment and control methods, which is applied in the fields of printed circuit manufacturing, electrical components, electrolytic process, etc., and can solve the problems of reduced surface quality, uneven plating thickness, uneven distribution of plating thickness, etc.

Inactive Publication Date: 2013-06-26
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0013] Due to different plating currents, the current density of the substrate is variable, and thus the distribution of plating thickness is not uniform
[0014] Therefore, the copper metal film of the printed circuit board generally has an uneven distribution of plating thickness, which reduces the surface quality and thus the reliability of the printed circuit board.

Method used

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  • Substrate plating apparatus and substrate plating control method
  • Substrate plating apparatus and substrate plating control method
  • Substrate plating apparatus and substrate plating control method

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Embodiment Construction

[0037] The objects, features and advantages of the present invention will be more clearly understood from the following description of the embodiments with reference to the accompanying drawings.

[0038] The terms and words used in the description and claims of the present invention should not be construed as being limited to the usual meanings or dictionary definitions, but should be understood as based on the rules on which the inventors can properly define the concepts of terms, these terms and Words have meanings and concepts related to the technical scope of the present invention to best describe his or her known methods for carrying out the present invention.

[0039] The above and other objects, features and advantages of the present invention can be more clearly understood through the following detailed description in conjunction with the accompanying drawings. In the specification, in adding reference numerals to different components in the drawings, it should be not...

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Abstract

Disclosed herein is a substrate plating apparatus, including: a constant current device supplying power; cathode hangers that includes a plurality of clamps holding substrates, hall current sensors mounted on each of the clamps to detect current information, and wireless communication modules connected with the hall current sensors to wirelessly transmit the current information to the outside; a current rail mounted with the plurality of cathode hangers above a plating bath and connected with the constant current device; and an anode unit extending from the constant current device and dipped in a plating solution of the plating bath.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2011-0139323, filed Dec. 21, 2011, entitled "Substrate Plating Apparatus and Substrate Plating Control Method," the entire contents of which are incorporated herein by reference . technical field [0003] The invention relates to a substrate electroplating equipment and a substrate electroplating control. Background technique [0004] In the prior art, in order to form metal lines on a printed circuit board, the lines are formed on the board by imitating a metal film. In this case, the metal film formed on the front surface of the substrate is formed by using aluminum or copper. Meanwhile, copper has great resistance to electromigration when improving the reliability of semiconductor devices due to its high melting point, and can increase signal transmission speed due to low resistance system copper. Therefore, copper metal films have been widel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D17/00C25D21/12H05K3/18
CPCC25D17/005C25D21/12C25D17/06H05K3/18C25D17/00
Inventor 李载灿
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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