Aligning method for unmarked substrate assembly

Abstract

The invention provides an aligning method for unmarked substrate assembly. The method includes the following steps: at least two standard local feature regions are predefined; at least two actual local images of a first substrate are captured; the at least two actual local feature images are compared and at least two actual local feature regions are obtained; an actual coordinate system of the first substrate are established; the actual coordinate system and a second substrate coordinate system are compared to obtain three kinds of offsets; the offsets are utilized for enabling the first substrate to move to a right position to be assembled; the first substrate is confirmed whether to be in the right position to be assembled or not; and the first substrate and a second substrate are utilized to be overlapped for assembly in an alignment mode. Therefore, the aligning method for the unmarked substrate assembly enables substrates to be assembled to have no requirement for any extra designed marks special for the purpose of alignment.

Description

technical field [0001] The invention relates to a method for assembling and aligning a substrate without a mark, in particular to a method for assembling and aligning a substrate without a mark by directly using the surface shape feature of the substrate as a reference mark to calculate the movement compensation amount of the substrate. Background technique [0002] At present, in the technical fields such as liquid crystal displays, semiconductor wafers, and printed circuit boards, there is a need for multiple substrates to be precisely stacked and assembled. Therefore, related companies continue to develop various alignment equipment or special alignment mark designs, in order to be accurate and Quickly assemble and align multiple substrates. [0003] For example, see figure 1 As shown, the invention patent No. I288365, which was previously applied and approved by the applicant in this case, discloses an alignment mark design and image processing method of a double-layer ...

AI Technical Summary

Problems solved by technology

[0011] The main purpose of the present invention is to provide a marking-free substrate assembly alignment method, which directly uses the existing surface shape features of a specific local area of ​​the substrate as a reference mark to replace the existing alignment holes and alignment marks, so that the assembly The base plate does not need to be designed with any special mark for alignment purposes, and can successfully calculate the amount of movement compensation required before assembly of the base plate, thus helping to reduce the cost of assembly alignment and improve the accuracy of assembly alignment

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