Aligning method and aligning system of unmarked different-space substrate assembly

A technology without marks and substrates, applied in the direction of electrical components, electrical components, etc., can solve the problems of inability to successfully complete the alignment operation, increase the process and cost, and be difficult to implement

Active Publication Date: 2013-06-19
METAL INDS RES & DEV CENT
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can automatically and quickly complete the precise alignment of double-layer boards, it is also prone to failure to complete the alignment work due to the problem of image overlap, and the alignment holes and alignment holes must be designed separately on the two substrates in advance. mark, it will increase the process and cost
Furthermore, when the space for assembling the first and second layer boards 11, 12 is limited, it may affect the three-axis motion control module 14 to move the second layer if the two imaging devices 13 are to be installed in the same limited assembly space. board 12, so that the above-mentioned double-layer board alignment motion control method is not easy to implement in a limited assembly space

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aligning method and aligning system of unmarked different-space substrate assembly
  • Aligning method and aligning system of unmarked different-space substrate assembly
  • Aligning method and aligning system of unmarked different-space substrate assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0079] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments of the present invention will be exemplified below, together with the accompanying drawings, and described in detail as follows. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inside", "outside" or "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0080] The present invention provides a method and system for assembling and aligning substrates in different spaces without marking, which mainly uses the existing surface shape features of the specific local areas of the two substrates as the two substrates when the two substrates are located in the second waiting space of different space s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an aligning method and an aligning system of unmarked different-space substrate assembly. The method includes the following steps: standard local feature regions of two substrates are predefined; at least two actual local images of the two substrates in different waiting space are respectively captured; the at least two actual local feature images are respectively compared to obtain at least two actual local feature regions of the two substrates; actual coordinate systems of the two substrates are respectively established; the actual coordinate systems of the two substrates are compared to obtain a group of offsets; utilization of the group of offsets and a reserved movement amount enable the two substrates to move to aligning assembly space from respective waiting space; and the two substrates are overlapped to be assembled in an alignment mode in the aligning assembly space.

Description

technical field [0001] The invention relates to a method and system for assembling and aligning substrates in different spaces without marks, in particular to a method and system for assembling and aligning substrates in different spaces without marks, in particular to a method of directly using the surface shape features of substrates as reference marks to calculate the movement compensation amounts of two substrates located in different space systems. A space substrate assembly alignment method and system. Background technique [0002] At present, in the technical fields of liquid crystal displays, semiconductor wafers, and printed circuit boards, there is a demand for precise stacking and assembly alignment of multiple substrates. Therefore, relevant companies continue to develop various alignment equipment or special alignment mark designs in order to achieve accurate and accurate alignment. Quickly assemble and align multiple substrates. [0003] For example, please re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/00H05K13/04
Inventor 林崇田温志群杨骏明杨筑钧
Owner METAL INDS RES & DEV CENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap