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Damp-proof processing method of electronic circuit board

An electronic circuit board and moisture-proof treatment technology, which is applied in the secondary treatment of printed circuits, coating non-metallic protective layers, etc., can solve the problem of poor uniformity and consistency of artificial moisture-proof agents, which cannot meet the moisture-proof treatment of electronic circuit boards, and are difficult to achieve moisture-proof Uniform spraying coverage and other issues, to meet the requirements of easy operation, harmless and emission control, easy automation and unmanned operation, and realize the effect of automation and unmanned operation

Inactive Publication Date: 2013-05-15
SHANGHAI SHARP ELECTRONICS +1
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AI Technical Summary

Problems solved by technology

[0005] 1. Various electrical components of different specifications and heights are installed on the surface of the electrical circuit board. Whether it is artificial brushing or spraying, it is difficult to meet the requirements of uniform moisture-proof spraying coverage and no dead ends.
[0006] 2. The uniformity and consistency of the artificial moisture-proof agent treatment are poor, and it is easy to cause undesirable phenomena such as missed brushing and uneven coating thickness, low work efficiency and poor quality stability
[0007] The existing invention patent "A Moisture-proof Process for Electronic Circuit Boards" (patent publication number CN102196674A) discloses a moisture-proof process for electronic circuit boards based on the above-mentioned shortcomings of the prior art: it is proposed to use two dipping paint treatments for electronic circuit boards, In order to achieve the beneficial effect of moisture-proof treatment of electronic circuit boards, but the inventors found that the treatment method of secondary dip coating can not meet the moisture-proof treatment of various electronic circuit boards

Method used

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  • Damp-proof processing method of electronic circuit board
  • Damp-proof processing method of electronic circuit board

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Embodiment Construction

[0029] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0030] Embodiments of the present invention relate to a moisture-proof treatment method for electronic circuit boards, using such as figure 1 The shown PCB board automatic spraying heating curing system includes a feeding area 1, a spraying room 2 and a drying room 3, including the following steps:

[0031] (1) Pre-cover the electronic circuit board in the feeding area 1, that is, cover the components and parts that are not sp...

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Abstract

The invention relates to a damp-proof processing method of an electronic circuit board. The damp-proof processing method of the electronic circuit board comprises the following steps that pre-covering processing is conducted on the electronic circuit board; an automatic spray gun conducts automatic and reciprocating spraying and coating on the electronic circuit board along the horizontal direction and the perpendicular direction; a face is turned automatically according to damp-proof requirements; and the sprayed and coated electronic circuit board is automatically heated and dried. According to the damp-proof processing method of the electronic circuit board, the electronic circuit board is ideal in damp-proof effect and reliable in quality guarantee and work efficiency, and therefore good performance of the electronic circuit board is guaranteed.

Description

technical field [0001] The invention relates to the technical field of processing electronic circuit boards, in particular to a moisture-proof processing method for electronic circuit boards. Background technique [0002] The harm caused by improper moisture-proof treatment of electronic circuit boards is mainly due to the fact that moisture can penetrate the IC plastic package and invade the interior of the IC from the gaps such as pins, resulting in IC moisture absorption, which in turn oxidizes the metal inside the IC device and reduces the insulation performance, resulting in product failure. Fault. Therefore, the moisture-proof treatment of the electronic circuit board becomes an important part of improving the working reliability and stability of the electronic circuit board. [0003] The moisture-proof treatment of electronic circuit boards in the prior art generally includes three treatment methods such as brushing, dipping and spraying. [0004] But the inventor o...

Claims

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Application Information

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IPC IPC(8): H05K3/22H05K3/28
Inventor 潘恒沧叶俊孙姝
Owner SHANGHAI SHARP ELECTRONICS
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