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Sandwich back plate device for connecting plug-in cards

A plug-in, sandwich-type technology, applied in digital data processing parts, instruments, electrical digital data processing, etc., can solve the problem of increasing design difficulty and production cost, restricting the size and position of reinforcing ribs, and improving design and processing complexity, etc. problems, to achieve the effect of simple structure, flexible design, and standardization of installation design

Active Publication Date: 2014-06-04
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As for the double-sided plug-in middle backplane structure, since there are plug-in boards on both sides, the two sides of the middle backplane are densely covered with sockets, and the distance between the plug-ins on both sides and the middle backplane is generally only about 12.5mm. , which leads to restrictions on the size and location of the ribs
Therefore, for the double-sided plug-in midplane structure, the reinforcement structure is not only very complicated, but also for each midplane, due to the different sockets, the reinforcement structure is inconsistent, which increases the complexity of design and processing.
Of the above three backplane installation structures, the second structure has lower structural strength and rigidity, and the first and third structures increase the design difficulty and production cost to varying degrees

Method used

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  • Sandwich back plate device for connecting plug-in cards
  • Sandwich back plate device for connecting plug-in cards
  • Sandwich back plate device for connecting plug-in cards

Examples

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Embodiment Construction

[0037] Such as figure 1 , figure 2 and image 3As shown, the sandwich-type backplane device used for connecting plug-in boards in this embodiment includes an intermediate backplane 1, a first subframe assembly 2 and a second subframe assembly 3 for installing a plug-in board, and the intermediate backplane 1 is connected to the second Between a subframe assembly 2 and the second subframe assembly 3, an intermediary backplane 1 is provided with a plug-in board for electrically connecting the plug-in board in the first subframe assembly 2 and the plug-in board in the second subframe assembly 3 board connector 11. In this embodiment, both the first subframe assembly 2 and the second subframe assembly 3 are independent metal frame structures. The plug-in board connector 11 can be classified into a backplane signal connector and a power connector. The power sockets on both sides of the board 1 are connected to each other. The signal sockets on the backplane are concentrated on...

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PUM

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Abstract

The invention discloses a sandwich back plate device for connecting plug-in cards. The sandwich back plate device comprises an intermediate back plate (1), and a first plug-in frame assembly (2) and a second plug-in frame assembly (3) for installing the plug-in cards, wherein the intermediate back plate (1) is connected between the first plug-in frame assembly (2) and the second plug-in frame assembly (3); and a connector (11) is arranged in the intermediate back plate (1) for electrically connecting a plug-in card in the first plug-in frame assembly (2) and a plug-in card in the second plug-in frame assembly (3). The sandwich back plate device provided by the invention is firm and reliable in connection, simple in structure, convenient in use and maintenance, and has low requirement for the thickness of the intermediate back plate, and the intermediate back plate has high bending rigidity and strength.

Description

technical field [0001] The invention relates to a high-density assembly structure in the field of high-performance computers and communication equipment, in particular to a sandwich-type backboard device for connecting plug-in boards. Background technique [0002] With the continuous improvement of the performance of high-performance computers, its computing performance has achieved a breakthrough from petaflops to petaflops, and a petaflop supercomputer is currently being developed. Such a large-scale calculation will lead to a sharp increase in the number of computer cabinets. Due to the limitation of the area of ​​the computer room, the number of cabinets cannot be too large. In order to increase the packing density of each computing cabinet, there is a demand for increasing the packing density of the computing cabinets. [0003] The methods for increasing the assembly density include: one is to increase the number of plug-in boards contained in each cabinet. For compu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16H01R13/46
Inventor 李元山罗煜峰徐炜遐金杰陈永德陈旭蒋句平胡军田宝华曹跃胜李晋文姚信安
Owner NAT UNIV OF DEFENSE TECH
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