Device monitoring method during semiconductor process

Abstract

The invention provides a method for monitoring devices in semiconductor process comprising: Step a, designing a sampling plan with fixed sample size before the beginning of the semiconductor process; Step b, determining whether to sample the wafers according to the sampling plan and dispatching the wafers to be sampled to each process device before the beginning of the process step, wherein the process device is used for performing the process step; Step c, performing the process step; Step d, sampling the wafers according to the sampling plan, and performing in-line inspection to the sampled wafers according to the sampling results; Step e, repeating Step b to Step d until all the process steps are completed; Step f, performing e-test to all the wafers. According to the method, the potential risk during the semiconductor process can be minimized through the coordination of the sampling plan and the dynamic risk flag.

Description

technical field [0001] The invention designs a monitoring method in the field of semiconductor manufacturing, in particular, an equipment monitoring method in a semiconductor manufacturing process that can improve product yield. Background technique [0002] The manufacture of semiconductor integrated circuits involves hundreds of process steps, and any one of these steps out of control may cause the final product to fail even if the other steps are well controlled. Therefore, monitoring each process step and having early warning is one of the key issues in the semiconductor integration process. [0003] Traditional semiconductor factories use two forms of monitoring, offline monitoring and online monitoring, to check the performance of equipment during operation. However, both of the above monitoring forms have limitations and risk periods, which bring uncertainty to production. Offline monitoring can only be carried out when the equipment is not in production, so that th...

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Problems solved by technology

However, both of the above forms of monitoring have limitations and risk periods, thus creating uncertainty in production

Offline monitoring can only be carried out when the equipment is not in production, so that the monitoring frequency is low, and the uncertainty in production cannot be monitored in time

Online monitoring is a part of the whole process, but it is usually impossible to inspect all wafers. After the products arrive at the online inspection station, they are selected according to the defined sampling rules. Products that do not meet the sampling rules are automatically skipped to the next station without making defects. Inspection, and the selection of running equipment after the product arrives at the main process site is random, so it may cause that the products released by a certain main process equipment within a period of time have not been inspected for defects. Time out of monitoring and monitoring, so that the risk expands

The actual practice of traditional semiconductor factories is the above-mentioned sampling inspection, which leads them to bear the risk of a large number of wafers being skipped in production

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