Halogen-free environment-friendly bonding agent and preparation method thereof

An adhesive and environmentally friendly technology, applied in the direction of adhesive types, non-polymer adhesive additives, aldehyde/ketone condensation polymer adhesives, etc., can solve problems such as environmental pollution and biological damage, and achieve durability Effects of good CAF, low water absorption, and low Z-CTE value

Active Publication Date: 2013-09-04
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is easy to produce toxic gases during this process, which will pollute the environment and cause damage to surrounding organisms

Method used

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  • Halogen-free environment-friendly bonding agent and preparation method thereof
  • Halogen-free environment-friendly bonding agent and preparation method thereof
  • Halogen-free environment-friendly bonding agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] 1. Raw material ratio of halogen-free environmental protection adhesive

[0050] raw material

Formula ratio (mass ratio)

[0051] DOPO Structural Epoxy Resin

64.83

Phosphorus-containing phenolic resin

5

Dicyandiamide curing agent

2

Diethyltetramethylimidazole

0.15

Aluminum hydroxide (average particle size<8μm)

7.4

Silica powder (i.e. SiO 2 Powder, average particle size <8μm)

5.5

Silane

0.12

DMF

15

[0052] 2. Preparation process:

[0053] a>Add DMF, silane and dicyandiamide curing agent into the mixing tank according to the proportion, start the high-speed stirrer to stir, and the speed of the stirrer is 1700 rpm, then add aluminum hydroxide and silicon micropowder and stir for 2 hours, control the stirring tank The temperature is at 40°C;

[0054] b>Add phosphorus-containing phenolic resin and DOPO structure epoxy resin within 50 min...

Embodiment 2

[0065] 1. Raw material ratio of halogen-free environmental protection adhesive

[0066] raw material

Formula ratio (mass ratio)

DOPO Structural Epoxy Resin

69.37

Phosphorus-containing phenolic resin

4

Dicyandiamide curing agent

2

Diethyltetramethylimidazole

1.15

Aluminum hydroxide (average particle size<8μm)

5.5

Silica powder (i.e. SiO 2 Powder, average particle size <8μm)

4.8

Silane

0.18

DMF

13

[0067] 2. Preparation process:

[0068] a>Add DMF, silane and dicyandiamide curing agent into the mixing tank according to the proportion, turn on the high-speed stirrer to stir, the stirrer speed is 1700 rpm, then add aluminum hydroxide, silicon micropowder and stir for 1-3 hours, control the stirring The temperature in the tank is 40°C;

[0069] b>Add phosphorus-containing phenolic resin and DOPO structure epoxy resin within 50 minutes after step a> is com...

Embodiment 3

[0080] 1. Raw material ratio of halogen-free environmental protection adhesive

[0081] raw material

Formula ratio (mass ratio)

DOPO Structural Epoxy Resin

56.45

Phosphorus-containing phenolic resin

6

Dicyandiamide curing agent

1.8

Diethyltetramethylimidazole

2.15

Aluminum hydroxide (average particle size<8μm)

6.9

Silica powder (i.e. SiO 2 Powder, average particle size <8μm)

7.5

Silane

0.20

DMF

19

[0082] 2. Preparation process:

[0083] a>Add DMF, silane and dicyandiamide curing agent into the mixing tank according to the proportion, start the high-speed stirrer to stir, and the speed of the stirrer is 1700 rpm, then add aluminum hydroxide and silicon micropowder and stir for 2 hours, control the stirring tank The temperature is at 40°C;

[0084] b>Add phosphorus-containing phenolic resin and DOPO structure epoxy resin within 50 minutes after step a...

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Abstract

The invention discloses a halogen-free environment-friendly bonding agent, and particularly relates to a bonding agent for producing halogen-free environment-friendly epoxy glass cloth-based copper foil-clad plate. The bonding agent is prepared by mixing phosphorus-containing epoxy resin with a structure of (6H)-dibenzo-(c,e)(1,2)-oxaphosphorin-6-ketone (DOPO) and auxiliary materials in a certain ratio, and is coated on glass fiber cloth to be used for producing a halogen-free copper-clad plate; and the bonding agent is prepared from the phosphorus-containing epoxy resin with the DOPO structure, phosphorus-containing phenolic resin, a dicyandiamide curing agent, an imidazole accelerator, a silane coupling agent, an inorganic filler and an organic solvent in a certain ratio.

Description

technical field [0001] The invention relates to the field of printed circuit copper clad laminates, in particular to a halogen-free environmental-friendly adhesive and a preparation method thereof. Background technique [0002] Fire prevention is a very important aspect of social security. According to statistics, fires caused by polymer materials account for a very large part of the fire incidence in countries all over the world. The main raw material of copper clad laminate is epoxy resin. The data shows that the limiting oxygen index of epoxy resin is 19.8 (limiting oxygen index less than 22 is a flammable material), which shows that epoxy copper clad laminate has high flammability. [0003] At present, the flame retardancy of conventional FR-4 products mainly depends on the halogen elements (commonly Br) in the raw resin. The raw resin is thermally decomposed during combustion to produce hydrogen halide, and the free radicals generated during thermal decomposition of po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J161/14C09J11/04C09J11/06
Inventor 况小军粟俊华席奎东
Owner NANYA NEW MATERIAL TECH CO LTD
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