Method for manufacturing multilayer circuit board
A technology of multi-layer circuit board and manufacturing method, which is applied in the field of circuit board manufacturing, and can solve the problems of reducing production efficiency, increasing production precision requirements, and slow speed
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[0051] The manufacturing method of the multilayer circuit board provided by this technical solution will be further described in detail below in conjunction with a number of drawings and implementations.
[0052] See figure 1 , The embodiment of the technical solution provides a manufacturing method of a multilayer circuit board, including the steps:
[0053] The first step, see figure 2 , Provide a first circuit substrate 11. The first circuit substrate 11 may be a single-layer board, a double-layer board or a multi-layer board. In this embodiment, the first circuit substrate 11 is a double-sided board for illustration. The first circuit substrate 11 includes a first circuit layer 111, a second circuit layer 113, and a first base layer 115 stacked in sequence.
[0054] The first circuit layer 111 and the second circuit layer 113 are located on both sides of the first base layer 115. The material of the first circuit layer 111 and the second circuit layer 113 can be one or an all...
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