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tube target

A tube target and carrier tube technology, which is applied in the field of tube targets, can solve problems such as damage, no longer covering, and target damage.

Active Publication Date: 2011-12-07
PROTECH MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, planar targets have the disadvantage that only about 30% to 40% of the material constituting the planar target is effectively sputtered
However, since the target also expands due to the high temperature of the plasma, radial fracture forces occur which lead to damage or complete destruction of the target, whereby a homogeneous coating is no longer possible

Method used

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Embodiment Construction

[0029] exist figure 1 The tube target 1 is shown schematically in a perspective view. For the sake of simplicity, the tube target is closed here with caps 2 , 3 . Tube Target 1 has the figure 1 The carrier tube surrounded by the target 1a is not visible in . The target 1 a is provided with a groove 4 which extends parallel to the axis of rotation 5 of the tube target 1 . The direction of rotation is indicated briefly by arrow 6 . The depth of the groove 4 is not fixed.

[0030] A plasma is present during the sputtering process above or below a portion of the tube target 1 . The plasma is substantially as long as the tube target 1 , but has a diameter smaller than the diameter of the tube target 1 . If the tube target 1 is rotated, the slot 4 is above or below the plasma for the entire length of the slot during the under or over coating of the plasma. The slot 4 immersing in the plasma, staying in the plasma or leaving from the plasma changes the plasma-facing surface of...

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Abstract

The invention relates to a tube target (50) for sputtering, having a target (46) disposed on a cylindrical carrier tube. Said target (46) is divided into a plurality of segments. The target (46) comprises at least one groove (51 - 54) diagonal to the axis of rotation thereof.

Description

technical field [0001] The present invention relates to a tube target according to the preamble of claim 1 . Background technique [0002] Most of the sputtering targets used in the past are so-called planar targets which are circular or rectangular in configuration. Flat targets, however, have the disadvantage that only about 30 to 40% of the material making up the flat target is effectively sputtered. [0003] To improve sputtering efficiency, tubular targets are increasingly used. But the manufacture of tubular targets is more difficult than the manufacture of flat targets. [0004] A method for producing a sputtering target is known, in which a cylindrical carrier element is first introduced into a mold in such a way that a gap is formed between the carrier element and the casting mold (EP 500 031 B1). [0005] The target material is then filled into the gap between the carrier element and the casting mold and the casting mold is closed. Then, an equalized thermal pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
CPCH01J37/3491C23C14/3407H01J37/3423H01J37/342C23C14/34
Inventor 迪特尔·乌兹格尔
Owner PROTECH MATERIALS INC
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