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Processing system and method of operating a processing system

A processing system and processing chamber technology, applied in the field of processing substrates, can solve problems such as yield and efficiency limitations, complex modules, etc., to achieve the effect of increasing efficiency

Active Publication Date: 2011-06-29
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, all of the above systems have some disadvantages
First, the system requires very complex and expensive modules, such as rotary modules
Second, the throughput and efficiency of systems are limited by their design

Method used

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  • Processing system and method of operating a processing system
  • Processing system and method of operating a processing system
  • Processing system and method of operating a processing system

Examples

Experimental program
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Embodiment Construction

[0083] figure 1 A first embodiment of a coating system 1 according to the invention is shown. The system 1 includes a substrate feed and receiving station (e.g., a swing table) 2 comprising a substrate operable at atmospheric pressure to feed substrates to and / or receive substrates processed in the coating system 1 from the chamber arrangement. swing module.

[0084] The first embodiment of the invention corresponds to a chamber arrangement including a lock chamber 3 and a first coating chamber 4 . The lock chamber 3 is configured as a combined lock-in / lock-out chamber. The first coating chamber 4 has a coating tool 4a for depositing layers on the substrate.

[0085] The chamber arrangement constituted by the lock chamber 3 and the first coating chamber 4 has a first substantially rectilinear transport path T1 indicated by a dotted line and a second substantially rectilinear transport path T2 indicated by a dotted line. The first transmission path T1 and the second transmi...

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PUM

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Abstract

The invention provides a processing system and a method of operating the processing system. A coating system 1 comprises a swing station 2 including a swing module and an arrangement of chambers. The arrangement of chambers comprises a lock chamber 3 and a first coating chamber 4. The lock chamber 3 is configured as a combined lock-in / lock-out chamber. The arrangement of chambers has a first substantially linear transport path T1 indicated by dashed lines, and a second substantially linear transport path T2 indicated by dashed lines. The arrangement of the paths T1 and T2 establishes a dual track. The system 1 includes a transport system for moving a substrate through the arrangement of chambers 3, 4 along the first transport path T1 and / or along the second transport path T2 as indicated by arrows. One or particularly both chambers 3 and 4 comprise transfer means for transferring the substrate / carrier from the first path T1 to the second path T2 by a lateral movement of a dual or triple track section and / or from the second path T2 to the first path T1.

Description

technical field [0001] The invention relates to a method for processing a substrate comprising a chamber arrangement comprising at least a first processing chamber for processing a substrate, a second processing chamber for processing a substrate and / or a transfer chamber; at least a lock chamber, It is configured to lock the substrate in the chamber arrangement and / or lock the substrate out of the chamber arrangement; a first substantially linear transport path for transporting the substrate from the lock chamber to the first processing chamber, and a second Two substantially linear transport paths are used to transport substrates through the chamber arrangement. The second transport path may be laterally offset relative to and positioned adjacent to the first transport path. Background technique [0002] In many technical applications, stacks of multiple layers are deposited on a substrate in a sequence of coating steps. For example, in TFT (Thin Film Transistor) metalli...

Claims

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Application Information

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IPC IPC(8): C23C14/56
CPCC23C14/568H01L21/67173H01L21/6719H01L21/67745
Inventor 拉尔夫·林德伯格尔卡恩·科帕拉托马斯·贝尔格
Owner APPLIED MATERIALS INC
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