Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Patent applicant technology development tendency analysis method

A technology for technological development and trend analysis, applied in the field of patent analysis to achieve the effect of meeting demand

Inactive Publication Date: 2011-06-29
J Z M C INTPROP DATA SCI & TECH
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no such targeted patent analysis method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Patent applicant technology development tendency analysis method
  • Patent applicant technology development tendency analysis method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Such as figure 1 Shown is a diagram of the implementation steps of the analysis method of the present invention. The system adopts an analysis system including a topic establishment module, a technology classification module, a technology classification selection module, an applicant information generation module and an image display module. Using this system to analyze the technological development trend of patent applicants includes the following steps:

[0020] 1) Use the topic building module to collect and analyze data from the patent database to establish a patent analysis topic database; the patent database here includes patent literature databases in various countries, such as China, the United States, Japan, the United Kingdom, France, Germany, Switzerland, Taiwan, South Korea, and Europe Databases of patent documents published by various countries such as patent offices and the World Intellectual Property Organization. Use the topic building module to search...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a patent applicant technology development tendency analysis method. An analysis system adopted in the method comprises a subject establishing module, a technology classification module, a technology classification selection module, an applicant information generating module and an image display module. In the method, a patent number tendency curve diagram of applicants of preset number over the years under the selected class is displayed in an image display module, the transverse axis of the diagram is patent time parameter, and the longitudinal axis is patent number. According to the method, the applicant technology development tendency of front ranking of each technology class in the field of a certain industry can be acquired, and the analysis is deeper and more specific.

Description

technical field [0001] The invention relates to a patent analysis method, in particular to a patent applicant's technology development trend analysis method. Background technique [0002] The analysis of patent technology is the key in patent analysis. The development of patented technology represents the development trend of new technology to a certain extent. The key technologies of patents in a certain industry are often concentrated in some major applicants. Research and analysis of the patents of these applicants is helpful to quickly grasp the technical hotspots in this field. However, due to the increasingly detailed division of labor, even in the same industry, the technical focus of applicants is different. Therefore, the trend analysis of the top applicants for each technical point is more accurate and the results obtained are more accurate. The analysis is also more in-depth. At present, there is no such targeted patent analysis method. Contents of the invent...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/30
Inventor 唐向东魏国柱
Owner J Z M C INTPROP DATA SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products