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Separation device and separation method thereof

A separation device and separation method technology, applied in the direction of chemical instruments and methods, layered products, lamination auxiliary operations, etc., can solve the problems of reduced efficiency, increased labor costs, printed circuit boards affecting the quality of printed circuit boards, etc., to ensure Quality, the effect of avoiding scratches

Inactive Publication Date: 2011-05-18
NAN YA PRINTED CIRCUIT BOARD CORPORATION
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the protective film is removed manually, in addition to increased labor costs and reduced efficiency, the printed circuit board is also damaged by scratches, contamination, and foreign matter sticking, which will affect the quality of the printed circuit board

Method used

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  • Separation device and separation method thereof
  • Separation device and separation method thereof
  • Separation device and separation method thereof

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Embodiment Construction

[0035] In order to make the above and other objects, features and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, together with the accompanying drawings, and is described in detail as follows:

[0036] Figure 1A , Figure 1B , Figure 1C , Figure 1D , Figure 1E , Figure 1F A schematic diagram showing the operating procedure for separating a first base material B and a second base material F1, F2 connected to each other by using the separation device M of the present invention, Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E , Figure 2F means corresponding to Figure 1A , Figure 1B , Figure 1C , Figure 1D , Figure 1E , Figure 1F A schematic side view of the operation procedure for separating the interconnected first substrate B and the second substrates F1 and F2 using the separation device of the present invention.

[0037] Please also see Figure 1A / 2A, Figure 1B / 2B, Figu...

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PUM

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Abstract

The invention discloses a separation device and a separation method thereof, which can realize complete separation of a first base material and a second base material connected with each other. The separation device comprises a pedestal and a first chuck unit. The pedestal is used for supporting the first base material and the second base material connected with each other. The first chuck unit can move between a first position and a second position relative to the pedestal. When the first chuck unit is positioned at a set position between the first position and the second position, the firstchuck unit causes local separation between the first base material and the second base material and clamps the separated second base material; and when the first chuck unit moves to the second position from the set position, the second base material clamped by the first chuck unit is completely separated from the base material by the drive of the first chuck unit. The separation device and the separation method can effectively promote the film tearing efficiency of a printed circuit board and reduce the manpower cost.

Description

technical field [0001] The invention relates to a separating device, in particular to a separating device capable of separating a film from a printed circuit board on which it is attached and a separating method thereof. Background technique [0002] After the lamination between the printed circuit board and the ABF film is completed, the protective film (for example, PE or PET (polyethylene terephthalate, polyethylene terephthalate film)) located on the ABF film is generally carried out manually. tear off. [0003] However, when the protective film is torn off manually, in addition to increasing the labor cost and reducing the efficiency, the printed circuit board is also damaged by scratches, pollution and foreign matter, which will affect the quality of the printed circuit board. Contents of the invention [0004] In view of this, the present invention provides a separation device and a separation method thereof, which can not only effectively improve the film tearing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B38/10
Inventor 秦启恒何信芳
Owner NAN YA PRINTED CIRCUIT BOARD CORPORATION
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