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Method for sustainably complementing metallic cations in plating solution

A technology of metal cations and cations, applied in the direction of cells, electrolytic processes, electrolytic components, etc., can solve the problems of wasting plating solution, environmental pollution of plating solution, waste of resources, etc., to reduce production costs, improve plating efficiency, and prolong service life. Effect

Inactive Publication Date: 2011-02-02
SUZHOU QUANLI PLATING HANGERS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the actual production process of electroplating, insoluble anodes are used a lot, which is also called inert anode system. In this electroplating process, since the electroplating metal ions in the electroplating solution will continue to decrease, it is necessary to add the prepared standard metal salt solution to supplement metal ions, such as in the process of nickel plating, it is necessary to continuously supplement nickel sulfate or other nickel salts to continue the electroplating, however, as the nickel ions in the supplemented nickel sulfate are consumed, the sulfate radical Ions or anions are retained, and then the charge in the plating solution will be unbalanced, so that the electroplating reaction cannot continue, so the plating solution must be poured out regularly, and a new plating solution must be reconfigured. Not only is the operation troublesome, the plating solution is wasted, and The drained electroplating solution seriously pollutes the environment
In addition, during the electroplating process, as the metal cations are gradually reduced, they will become acidified at the same time, because the following reaction will occur at this time: 2H 2 O=O 2 +4H + +4e - or 4OH - =O 2 +2H 2 O+4e - (in alkaline plating solution), these two kinds of reactions all can cause the PH value of solution to drop, so must add the compound that adjusts solution PH value, both waste resources like this, also increase labor intensity, inconvenient operation, and add and adjust plating solution PH After the compound with high value is used, the pH value of the plating solution cannot be kept stable, which seriously affects the effect and efficiency of electroplating.

Method used

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  • Method for sustainably complementing metallic cations in plating solution
  • Method for sustainably complementing metallic cations in plating solution
  • Method for sustainably complementing metallic cations in plating solution

Examples

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Embodiment 1

[0019] Embodiment 1, electroplating metallic nickel;

[0020] A method for continuously replenishing metal cations (nickel ions) in the plating solution. During the electroplating process, the plating solution in the electroplating device is sent into the cation generator. When the cation generator works, nickel ions will be generated, and the The plating solution of nickel ions is sent back to the electroplating device, and circulates like this to supplement the consumed metallic nickel ions in the plating solution of the electroplating device.

[0021] like figure 1 Shown, the cation generating device that the present invention adopts comprises electrolytic cell 1, and the anode 2 that is provided with in electrolytic cell 1 is a nickel post, and the negative electrode 3 that is provided with in electrolytic cell 1 is a graphite rod, also includes the connected anode 2 and negative electrode. 3 of the electrolysis power supply 4, the positive pole of the electrolysis power ...

Embodiment 2

[0024] Embodiment 2, electroplating metal copper;

[0025] A method for continuously replenishing metal cations (copper ions) in the plating solution. During the electroplating process, the plating solution in the electroplating device is sent into the cation generator. When the cation generator works, copper ions will be generated, and the The plating solution of copper ions is sent back to the electroplating device, and circulates like this to replenish the consumed metal copper ions in the plating solution of the electroplating device;

[0026] like figure 1 As shown, the cation generating device adopted in the present invention includes an electrolytic cell 1, in which an anode 2 is a copper column, and the others are the same as in Embodiment 1.

[0027] like figure 2 It further shows a method process of the present invention that can sustainably replenish metal cations (copper ions) in the plating solution. During electroplating, the cation generating device is used i...

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Abstract

The invention discloses a method for sustainably complementing metallic cations in plating solution. In the process of plating, the plating solution in a plating device is delivered into a cation generator; the cation generator can generate coated metal cations during working; the plating solution containing the metal cations is delivered back to the plating device; and the steps are circulated so as to complement the metallic cations consumed in the plating solution of the plating device. The method can sustainably complement the metallic cations consumed in the plating solution, so as to avoid pouring the plating solution lacking the cations and preparing new plating solution again. By the method, the plating solution can be continuously used, the service life of the plating solution is prolonged, the plating solution does not be wasted so as to reduce production cost, and environmental pollution is reduced to achieve the aims of saving energy and reducing emission.

Description

technical field [0001] The invention relates to the electroplating industry, in particular to a method for continuously replenishing metal cations to an electroplating solution during electroplating. Background technique [0002] In the actual production process of electroplating, insoluble anodes are used a lot, which is also called inert anode system. In this electroplating process, since the electroplating metal ions in the electroplating solution will continue to decrease, it is necessary to add the prepared standard metal salt solution to supplement metal ions, such as in the process of nickel plating, it is necessary to continuously supplement nickel sulfate or other nickel salts to continue the electroplating, however, as the nickel ions in the supplemented nickel sulfate are consumed, the sulfate radical Ions or anions are retained, and then the charge in the plating solution will be unbalanced, so that the electroplating reaction cannot continue, so the plating solu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/18
Inventor 蔡有利
Owner SUZHOU QUANLI PLATING HANGERS
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