Uniform-temperature panel and manufacturing method thereof

Abstract

A manufacturing method of a uniform-temperature panel comprises the following steps: providing an elongated hollow extruded section and cutting the section into a plurality of shells with accommodating cavities inside according to the preset dimension; forming capillary structure layers on the inner surfaces of the shells, corresponding to the accommodating cavities; vertically placing a plurality of support elements in the accommodating cavities of the shells, wherein two opposite ends of the support elements are respectively fixedly connected with the shells; sealing the accommodating cavities of the shells; and injecting liquid working media into the accommodating cavities from reserved liquid injection holes, vacuumizing and sealing the accommodating cavities. Compared with the prior art, the manufacturing method of the invention saves the production cost and is suitable for scale production and manufacturing because of adopting the elongated hollow extruded section and cutting the section into a plurality of shells according to the preset dimension. Meanwhile, the accommodating cavities of the uniform-temperature panel manufactured by the method accommodate a plurality of support elements and the support elements play a role of intensive support for the shells, thus improving the structural support intensity of the uniform-temperature panel.

Description

technical field [0001] The invention relates to a uniform temperature plate and a manufacturing method thereof, in particular to a uniform temperature plate for cooling electronic components and a manufacturing method thereof. Background technique [0002] High-power electronic components such as computer central processing units, north bridge chips, and light-emitting diodes are developing toward lighter, thinner, multi-functional, and faster-running trends, and the heat generated per unit area during operation is also increasing. These If the heat cannot be dissipated in a timely and effective manner, it will directly lead to a sharp rise in temperature, which will seriously affect the normal operation of the heating electronic components. For this reason, it is necessary to use a heat sink to dissipate heat from these electronic components. [0003] The most typical heat dissipation device is a finned radiator, which achieves the purpose of heat dissipation through the c...

AI Technical Summary

Problems solved by technology

However, during the process of manufacturing, transportation, installation or use, the vapor chamber is often subject to collisions. Since the vapor chamber has a cavity structure, the vapor chamber is easily squeezed and the sealing cavity is deformed, which in turn affects the working medium. Evaporation efficiency, even lead to the rupture of the sealed chamber and damage

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