Quick sorting and arranging machine of crystalline grain and quick sorting and arranging method of crystalline grain

Abstract

The invention is suitable for crystalline grain sorting and arranging technology, providing a quick sorting and arranging machine of crystalline grain and a quick sorting and arranging method of the crystalline grain. A loading tray to be classified is moved to an image shooting device for shooting images to obtain the current position data of the crystalline grains, wherein plural crystalline grains are arranged on the loading tray, and all crystalline grains are detected by a detection machine so as to ensure the electrical characteristic of each crystalline grain and respective position; the current position data of the crystalline grains is compared with prestored position data to confirm that the crystalline grain of each crystalline grain characteristic is put on the position of the loading tray to be classified. Then, the loading tray to be classified is moved to an adsorption position to ensure that a picking and placing device adsorbs the crystalline grain to put the crystalline grain on the corresponding classified loading tray under the monitoring of a loading monitoring device with high resolution and small-range shooting; meanwhile, one piece of crystalline grain monitoring equipment monitors the crystalline grain placing position in real time; multiple groups of detection equipment receptively divide labor and operate, which not only improves working efficiency, but also reduces the problem of operation overloading caused by single detection equipment.

Description

technical field [0001] The invention relates to a technology for sorting and arranging crystal grains, in particular to a rapid sorting and arranging machine for grains and a method for rapidly sorting and arranging grains. Background technique [0002] In order to meet the trend of light, thin and short electronic devices, most of the current circuit components are miniaturized and laid out on the semiconductor substrate, and the components required by the electronic products are manufactured through semiconductor technology. Semiconductor materials are first cut from grown crystals to form wafers, and wiring is carried out on the wafers to form prototypes of tens of thousands of circuit elements, and then grooves are cut between the circuit elements. Then the entire wafer is moved to a sticky flexible base layer to be adhered. At present, the common flexible base layer is a blue film, so it is generally called "blue film". When the flexible base layer is pulled to the out...

AI Technical Summary

Problems solved by technology

[0010] However, on the one hand, the surveillance camera at the pick-up position needs to repeatedly switch between low-resolution wide-range photography and high-resolution small-scale photography, which interrupts the pick-up process and the comparison process, causing delays in the workflow

On the other hand, continuous high-resolution and low-resolution magnification switching of surveillance cameras will not only cause consumable damage to machinery and equipment, reduce service life, increase the cost of downtime, maintenance and replacement of photographic equipment, resulting in poor work efficiency, but also Due to the continuous reciprocating autofocus, occasional out-of-focus problems increase the frequency of shutdowns

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