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Double-opening spout for dodging chip element

A double-opening and pot-mouth technology, which is applied in the direction of assembling printed circuits with electric components, can solve the problems of low work efficiency, easy to form false soldering of contacts, and is not suitable for large-scale batch processing, so as to ensure sufficientness and firmness. Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Double-opening spout for dodging chip element
  • Double-opening spout for dodging chip element
  • Double-opening spout for dodging chip element

Examples

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Embodiment Construction

[0013] Such as figure 1 The shown chip element avoids a double-opening spout, the spout is rectangular in shape, a tin overflow port 1 is provided on one side edge of the rectangular side, and an inner groove 2 is provided on the other side of the rectangular side. The overflow tin opening 1 is a rectangular gap with a depth of 3-4mm, and the bottom of the inner groove 2 is a semicircular arc surface

[0014] Such as figure 2 As shown, the spout of the present invention is mainly applied to the welding of electronic components 3 with short single-row lead wires, and the hatched part in the figure represents the tin overflow spout. On the PCBA board 5 , there are no other electronic components 3 outside the single row of leads or they are relatively far away, so that the tin liquid flowing out from the overflow tin opening 1 will not flow onto the electronic components 3 . The chip element is located in the inner groove 2.

[0015] When in use, place the PCBA board at a pre...

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PUM

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Abstract

The present invention discloses a double-opening spout for dodging chip elements, which is a tin furnace component for welding tin on PCBA plates, in particular to a spout of a tin furnace for welding chip elements on a computer main board. The spout is rectangular, wherein the side edge of one rectangular edge is provided with a tin spilling opening while the other side of the rectangular edge is provided with an inner groove. The double-opening spout with simple structure is capable of effectively improving welding efficiency and is adaptable to large-scale automatic production. Besides, the double-opening spout can effectively prevent an oxide layer on tin liquor surface from remaining on the surface of a PCBA plate, thereby guaranteeing the quality of welding spots.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout used for soldering chip components of a computer main board. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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