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Method for keeping consistency of thickness of copper-clad plate

A copper clad laminate, consistent technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problem of waste of copper and other raw materials, and achieve the effect of saving raw material waste, increasing accuracy, and improving utilization.

Inactive Publication Date: 2010-05-05
陈国富
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure the quality of the board, the copper clad laminate factory usually cuts off the thinner parts of the four edges of the pressed copper clad laminate, which causes a huge waste of copper and other raw materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The method for keeping the thickness of the copper clad laminate consistent in the present invention is to make the thickness of the four straight edges and the four corners of the stainless steel fixing plate used for pressing the copper clad laminate smaller than the thickness of other parts, so that each part of the copper clad laminate is pressed evenly to compensate Thickness reduction due to glue flow at the edge of the copper clad laminate. Specifically, slopes or steps with a thickness smaller than other parts are formed at the edges and four corners of the four straight sides of the stainless steel fixing plate used for pressing the copper clad laminate. The bevel or step can be processed by known molding, grinding or cutting techniques.

[0015] When processing copper clad laminates, since the thickness of the edges of the four sides of the stainless steel fixing plate is smaller than that of other parts, the pressure on the copper clad laminates at this part ...

Embodiment 2

[0017] The difference from Example 1 is that the portion with a smaller thickness forms a recess near the edges of the four sides of the pressed stainless steel fixing plate. Specifically, the recess is formed at a distance from the stainless steel fixing plate used for pressing the copper clad laminate. The edges of the four sides are about 2-4mm. The concave part can be a concave inclined surface or an arc surface, which can generate resistance to glue flow, and also prevent glue flow and virtual edges of the copper clad laminate during the pressing process.

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PUM

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Abstract

The invention relates to a method for keeping the consistency of the thickness of a copper-clad plate. The thickness of the edges of four sides and four corners of a stainless steel fixed plate used for pressing a copper-clad plate is smaller than that of other parts so as to enable each position of the copper-clad plate to be pressed evenly in order to compensate thickness decrease caused by flow glue of the edges of the copper-clad plate, or, the thickness of the edges being near the four sides of the stainless steel fixed plate used for pressing the copper-clad plate is small than that of other parts so as to avoid the thickness decrease caused by flow glue of the edges of the copper-clad plate. The invention can effectively reduce the flow glue and virtual edges in the pressing process of the copper-clad plate, thereby increasing the product percent of pass, saving raw materials and reducing the production cost.

Description

【Technical field】 [0001] The invention relates to a copper-clad laminate used as a printed circuit board (PCB) substrate, in particular to a method for maintaining the thickness consistency of the copper-clad laminate to avoid edge trimming of the copper-clad laminate due to thinner edges after processing. 【Background technique】 [0002] Copper clad laminate is the substrate used by circuit board factories to make printed circuit boards, and it is also the most important raw material used by circuit board factories. The invention of copper clad laminates and circuit boards has led to the rapid development of the electronics industry. Almost all electronic products are inseparable from circuit boards and the copper clad laminates used to make circuit boards. For decades, due to the rapid development of the electronics and computer industries, the large-scale expansion of copper clad laminates has been promoted. Now the global monthly output is about 20 million square meters,...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 陈国富
Owner 陈国富
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