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Substrate transfer equipment and substrate processing system using the same

A substrate processing system and transmission equipment technology, applied in the direction of conveyor objects, transportation and packaging, manipulators, etc., can solve the problems of equipment cost and installation cost increase, time loss, etc.

Inactive Publication Date: 2009-06-17
AFO株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, although multiple substrates are processed simultaneously (or sequentially) within a single processing chamber, time is still lost when pre-processed and processed substrates are not efficiently exchanged within the processing chamber
[0006] Furthermore, when a conventional cluster system includes a hexagonal transfer chamber (basically including four process chambers and two load lock chambers), due to the area occupied by the transfer chamber, compared to maintaining the transfer chamber The expected width and size of the vacuum system required in the vacuum state increases, the area of ​​the cluster system and the width of the entire cluster system (which is important for the configuration of the cluster system in the production line) increase more, which leads to equipment cost and placement Increased costs

Method used

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  • Substrate transfer equipment and substrate processing system using the same
  • Substrate transfer equipment and substrate processing system using the same
  • Substrate transfer equipment and substrate processing system using the same

Examples

Experimental program
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Effect test

Embodiment 1

[0116] figure 1 is a view showing the overall configuration of the substrate processing system according to the first embodiment of the present invention, figure 2 is shown figure 1 A floor plan of the substrate handling system. refer to figure 1 A substrate processing system according to an embodiment of the present invention includes first and second processing chambers 500 , 600 and a transfer chamber 400 disposed between the first and second processing chambers 500 , 600 . The index plate 100 is installed in front of the load lock chamber 200, and a plurality of carriers 110 are installed in the index plate 100. As shown in FIG. Index plate 100 is referred to as an equipment front end module (hereinafter EFEM), and in some instances is indicated to include a load lock chamber. If desired, the load lock chamber 200 may include a cooling chamber 300 for cooling processed substrates.

[0117] The load lock chamber 200 includes an atmospheric pressure transfer robot 210 ...

Embodiment 2

[0142] Figure 17 is a plan view of a substrate processing system according to a second embodiment of the present invention, Figure 18 is a view showing the flow of substrates transported by the substrate transport device.

[0143] Referring to the drawings, a substrate processing system according to a second embodiment of the present invention includes the same configuration as the first embodiment, and further includes a load lock chamber 250 provided with an atmospheric pressure transfer robot 260 at the rear side, and an index plate 150 . In addition, a fourth substrate entrance 420 is formed in the transfer chamber 400 and the post load lock chamber 250 . In the substrate processing system, unprocessed substrates are loaded on the front side, and processed substrates are unloaded on the rear side. Here, the rear load lock chamber 250 may include a cooling chamber 300 for cooling the substrate. Figure 18 Arrows S100 to S130 in FIG. 2 indicate the flow of unprocessed ...

Embodiment 3

[0148] Figure 21 is a view showing the overall configuration of a substrate processing system according to a third embodiment of the present invention, Figure 22 yes Figure 21 Plan view of the substrate handling system.

[0149] refer to Figure 21 , 22 , The substrate transfer apparatus according to this embodiment of the present invention includes first and second process chambers 1500, 1600 and a transfer chamber 1400 disposed therebetween. The index plate 1100 is installed in front of the load lock chamber 1200 , and a plurality of carriers 1110 are installed in the index plate 1100 . Index plate 1100 is referred to as an equipment front end module (hereinafter EFEM), and in some instances is indicated to include a load lock chamber. If desired, the load lock chamber 1200 may include a cooling chamber 1300 for cooling processed substrates.

[0150] The load lock chamber 1200 includes an atmospheric pressure transfer robot 1210 operating at atmospheric pressure. T...

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Abstract

There are provided a substrate transferring apparatus for continuously loading / unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity and a substrate processing system using the same. The substrate transfer apparatus is installed in the transfer chamber and transfers substrates between first and second process chambers which is positioned lateral sides of the transfer chamber and a load rock chamber. The substrate transfer apparatus includes a driving unit to supply a rotational force, a spindle connected to the driving unit, first swivel plate arms to load / unload substrate to / from first process chamber, and second swivel plate arms to load / unload substrate to / from second process chamber. Since substrates before and after being processed are rapidly exchanged during the simultaneous or continuous process of plural substrates, processing rate increases and overall productivity can be increased.

Description

technical field [0001] The present invention relates to a substrate transfer device and a substrate processing system, and more particularly, to a substrate transfer device for continuously loading / unloading a plurality of substrates into / from a processing chamber to reduce the number of transfer substrates time spent and improve productivity. And the present invention relates to a substrate processing system using the device. Background technique [0002] Recently, a cluster system capable of simultaneously processing a plurality of substrates is commonly used in substrate processing systems for manufacturing liquid crystal displays, plasma panel displays, and semiconductor devices. [0003] A cluster system generally refers to a multi-chamber substrate processing system, and the processing system includes a transfer robot (or conveying device) and a plurality of substrate processing modules arranged around the transfer robot. [0004] The cluster system includes a transf...

Claims

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Application Information

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IPC IPC(8): H01L21/677
CPCB25J9/02B25J11/0095B25J15/0014B25J15/0019
Inventor 魏淳任
Owner AFO株式会社
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