Electromagnetic bandgap structure and printed circuit board

Abstract

The invention disclose an electromagnetic bandgap structure and printed circuit board euipped with the electromagnetic bandgap structure. According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

Description

[0001] Related Application Cross Reference [0002] This application claims priority from Korean Patent Applications No. 10-2007-0126760 and No. 10-2008-0057443 filed with the Korean Intellectual Property Office on December 7, 2007 and June 18, 2008, the disclosures of which are incorporated in their entirety This article is for reference only. technical field [0003] The present invention relates to an electromagnetic bandgap structure, and more particularly, to an electromagnetic bandgap structure capable of preventing signal transmission within a predetermined frequency band range and a printed circuit board having the electromagnetic bandgap structure. Background technique [0004] New electronic and communication devices are becoming increasingly smaller, thinner and lighter, reflecting today's emphasis on increased mobility. [0005] These electronic and communication devices have various complex electronic circuits (ie, analog circuits and digital circuits) for carr...

AI Technical Summary

Problems solved by technology

Especially when electronic equipment uses higher frequency bands, the typical bypass capacitor method or decoupling capacitor method used to solve the conduction noise problem is no longer suitable

[0013] Furthermore, when multiple active and passive devices need to be implemented in a complex wiring board with various electronic circuits formed on the same board or within a narrow area such as a system in package (SiP) or when When the operating frequency requires a higher frequency band, such as in a network board (network board), the above solutions are not suitable

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