Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus and method for cleaning of objects, in particular of thin discs

A technology of equipment and equipment pairs, applied in the direction of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., can solve the influence of processing process, can not guarantee the quality of surface performance, can not guarantee standardized and reproducible results, etc. problem, to achieve the effect of uniform flow characteristics

Inactive Publication Date: 2009-02-04
RENA有限责任公司
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the mortar continues to adhere there, which greatly affects the next processing
[0013] A common disadvantage of this manual treatment is that it is not possible to guarantee consistent quality in terms of surface properties and thus standardized and reproducible results

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for cleaning of objects, in particular of thin discs
  • Apparatus and method for cleaning of objects, in particular of thin discs
  • Apparatus and method for cleaning of objects, in particular of thin discs

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] figure 1 A substrate piece 1 to be cleaned is shown. The substrate block 1 is arranged on a support device 2 , which in turn comprises a glass pane 3 and fastening elements 4 . In the exemplary embodiment shown here, the substrate block 1 is adhered to the glass pane 3 with one side 5 in a planar manner. The cutouts of the already performed sawing process extend into the glass pane 3 , by means of which individual substrates are produced, which are also referred to as wafers 6 . Interspaces 7 are produced between the individual wafers 6 in each case, in which there is a so-called mortar (not shown in the drawing) which is to be removed by the cleaning process according to the invention.

[0047] In order to be able to hand over the substrate block 1 connected to the support device 2 to the device according to the invention as in Figure 4 and the equipment shown in 5, handing over the stand device 2 as in figure 2 and 3 Auxiliary device 8 shown in. The auxiliary...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a device for cleaning thin wafers (6), said wafers (6) being immobilized with one side on a support device (2) and an interspace (7) being defined between two respective adjoining substrates. The device essentially consists of a shower device (15) which is used to introduce a fluid between the interspaces (7), and a tank (14) that can be filled with the fluid and is dimensioned to receive the support device (2). The invention is characterized in that optionally either the shower device (15) can be displaced relative to the stationary support device (2), or the support device (2) relative to the stationary shower device (15), or both the support device (2) and the shower device (15) can be displaced relative each other. The method according to the invention is characterized by showering, preferably in a cleaning step, the wafers with warm fluid, the support device (2) being displaced inside the tank, then ultrasound-cleaning them in cold fluid and again showering them with warm fluid.

Description

technical field [0001] The present invention generally relates to an apparatus and a method for cleaning thin disks such as semiconductor wafers, glass substrates, photomasks, optical disks or the like. In particular, the invention relates to a device and a method for pre-cleaning semiconductor wafers after they have been produced from blocks of material by sawing. [0002] definition [0003] According to the invention, the term "thin disk" refers to objects which have a very small thickness in the range between 80 and 300 microns, for example between 150 and 170 microns. The shape of the disk is arbitrary and can be, for example, essentially circular (semiconductor wafer) or essentially rectangular or square (solar wafer), wherein the corners can optionally be configured as angular, inverted round or chamfered. These items are very prone to cracking due to their tiny thickness. The present invention relates to the pre-cleaning of said items. [0004] For reasons of und...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCB08B3/10B08B3/02H01L21/67326B08B11/02H01L21/67023H01L21/67051H01L21/67057H01L21/67313H01L21/302
Inventor N·伯格
Owner RENA有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com