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Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof

A silicon carbide particle and enhanced technology, which is applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems such as not being able to meet environmental protection, and achieve good mechanical properties, simple preparation methods, and long service life.

Inactive Publication Date: 2008-12-17
太仓市南仓金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology improves upon existing methods by adding SiC (Silicone Carbon) powders on top or around certain metals like silver for added strengthening purposes during manufacturing processes. These improvements make it more durable than previous techniques while also making them easier to use at high temperatures without losing their effectiveness over time due to poor wetting characteristics caused by these materials.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the quality of solventless brazing materials for use in electronics devices due to their excellent physical characteristics such as good tensile strength under repeated cycles of strain or impact loadings while also being environmentally friendly because they contain no harmful metals like bismuth (Bi).

Method used

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  • Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof
  • Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof
  • Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The formula of the silicon carbide particle-reinforced tin-silver-zinc composite solder according to this embodiment is: tin-silver-zinc solder and 0.3% silicon carbide particles. The average size of silicon carbide particles is 10 μm, and in the tin-silver-zinc solder, the mass ratio of tin, silver, and zinc is 96.1:3:0.9.

[0027] The solder of this example is recorded as: 0.3% SiC reinforced Sn-3% Ag-0.9% Zn, and its preparation process is as follows:

[0028] ①. Heat the tin, silver and zinc with a purity of 99.99% to 1200°C in a vacuum melting furnace under the protection of argon according to the formula ratio, and at the same time add magnetic stirring to make the alloy composition uniform, then water-cool and solidify, and then melt the alloy After turning over, reheat to 1200°C to melt, and at the same time, add magnetic stirring and water cooling, repeat this at least five times, and obtain a button-shaped tin-silver-zinc solder with a diameter of 3.0 to 3.5 c...

Embodiment 2

[0031] The silicon carbide particle-reinforced tin-silver-zinc composite solder according to this embodiment includes tin-silver-zinc solder and 0.1% silicon carbide particles. The silicon carbide particles have an average size of 10 μm. The tin-silver-zinc solder is composed of tin, silver, zinc and indium in a mass ratio of 95:3.5:0.5:1.

[0032] The solder in this example is marked as: 0.1% SiC reinforced Sn-3.5% Ag-0.5% Zn-1% In, and its preparation process is as follows:

[0033] ①. The tin, silver, zinc and indium with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon according to the formula ratio, and magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified. Turn the alloy over and reheat it to 1200°C to melt, and at the same time add magnetic stirring and water cooling, so repeat at least five times to get a button-shaped tin-silver-zinc solder with a diameter of ...

Embodiment 3

[0036] The silicon carbide particle-reinforced tin-silver-zinc composite solder according to this embodiment includes tin-silver-zinc solder and 0.5% silicon carbide particles. The silicon carbide particles have an average size of 10 μm. The tin-silver-zinc solder is composed of tin, silver, zinc and gallium with a purity of 99.99% in a mass ratio of 94.6:3.7:1.2:0.5.

[0037] The solder in this example is marked as: 0.5% SiC reinforced Sn-3.7% Ag-1.2% Zn-0.5% Ga, and its preparation process is as follows:

[0038] ①. The tin, silver, zinc and gallium with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon according to the formula ratio, and magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified. Turn the alloy over and reheat it to 1200°C to melt, and at the same time add magnetic stirring and water cooling, so repeat at least five times to get a button-shaped tin-silver...

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Abstract

The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method. The silicon carbide particle reinforced type tin, silver and zinc composite solder comprises a tin, silver and zinc solder and the silicon carbide particles accounting for 0.01-1 percent of the weight of the tin, silver and zinc solder; according to parts by weight, the tin, silver and zinc solder comprises 80-98 portions of tin, 0.1-5 portions of silver and 0.1-5 portions of zinc. The tin, silver and zinc solder, due to the addition of the silicon carbide, has better mechanical property, and can serve better under the working conditions of a thermal shock environment, with long service life. In addition, under vacuum protection, silicon carbide particles and button-shaped tin, silver and zinc solder are heated to 230-280 DEG C; after even stirring and cooling, the silicon carbide particle reinforced type tin, silver and zinc composite solder can be acquired, and the preparation is simple.

Description

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Claims

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Application Information

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Owner 太仓市南仓金属材料有限公司
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