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A kettle mouth with tin apron at tin overflow mouth

Inactive Publication Date: 2008-03-26
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. In addition, the usual design of the spout cannot protect some components located in the area above the spout, so as to prevent the components from contacting the tin liquid. , which can effectively protect the tin furnace spout of components that do not need to be soldered above the spout

Method used

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  • A kettle mouth with tin apron at tin overflow mouth

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Embodiment Construction

[0013] As shown in Figure 1, there is a tin-shielding plate-shaped spout outside the overflow tin spout. There is at least one tin overflow opening 2 around the tin opening. The shape of the spout is a rectangle, and at least one tin overflow opening 1 is provided on the long sides of the rectangle. The tin overflow opening 1 is a rectangular opening with a depth of 2-8 mm.

[0014] As shown in FIG. 2 , the spout of the present invention is mainly used when there are some electronic components 4 that do not need to be soldered above the spout. The tin baffle 1 installed at the tin outlet of the pot mouth blocks the tin liquid gushing out of the upper spout, so that the tin liquid changes the flow direction after hitting the tin baffle 1, diverts from both sides of the tin baffle 1, and then flows from the pot. Mouth out of tin mouth out,

[0015] According to the distribution of the lead wires to be welded on the PCBA board 3 and the distribution of the electronic components...

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Abstract

The invention relates to a tin furnace component used to PCBA board soldering tin, in particular to a tin furnace kettle orifice. The kettle orifice has a rectangular shape, at least one tin overflow outlet is positioned around the kettle orifice tin outlet, a half-surrounded tin-shield board is extended outward at both sides of the tin overflow outlet, the tin overflow outlet is a rectangular opening, the deepness is 2-8mm. The invention has a simple structure, can protect elements around outside of the overflow tin effectively through arranging the tin-shield board, realizes selective protection for elements on the PCBA board above the kettle orifice, in addition, effectively prevents an oxide layer of the tin liquid surface from remaining on the PCBA board, assures the welding joint quality.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guara...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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