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A tin overflow internal open L kettle mouth

A technology of overflowing tin and pot mouth, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of low work efficiency, unsuitable for large-scale batch processing, and easy to form false soldering of contacts, etc., to ensure the sufficiency and firmness Effect

Inactive Publication Date: 2008-03-26
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • A tin overflow internal open L kettle mouth

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Embodiment Construction

[0012] As shown in Figure 1, an L-shaped spout is opened inside the overflow spout, and the ends of the two rectangular spouts are fixedly connected into an "L" shape, and a tin overflow spout is provided at the tin outlet inside the "L"-shaped spout 1. The tin overflow opening 1 is a rectangular opening with a depth of 2-8 mm.

[0013] As shown in Figure 2, the spout of the present invention is mainly applied to the centralized distribution of electronic components 3 on the PCBA board 2 in an "L", and there are other electronic components 3 adjacent to the spout on the outside of the "L" semi-enclosed structure. Exist, and the inner side has no electronic components 3 or is relatively far from the distance of the spout.

[0014] When in use, place the PCBA board 2 at a predetermined position above the spout, and keep a certain distance between the plane of the board and the tin outlet of the spout, generally controlled at 2-6mm. The shape of the spout can be determined accor...

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Abstract

The invention relates to a tin furnace component used to PCBA board soldering tin, in particular to a tin furnace kettle orifice. Two rectangular kettle orifice ends are connected to be a 'L' shape, a tin overflow orifice is arranged at the tin outlet of the inner side of the 'L' shaped kettle orifice, the tin overflow orifice is a rectangular opening, the deepness is 2-8mm. The invention has a simple structure, can improve the soldering efficiency, is suitable for mass automatic production, in addition, effectively prevents an oxide layer of the tin liquid surface from remaining on the PCBA board, assures the welding joint quality.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guara...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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