Display device and manufacturing method thereof

Abstract

The present invention provides an active matrix type liquid crystal display device capable of reducing the incidence of display defects caused by electrostatic damage to electrodes or insulating layers between electrodes in the manufacturing process of liquid crystal display devices and improving the time constant of scanning lines Used, a liquid crystal display device having a wiring structure of fine wiring and a method of manufacturing the liquid crystal display device. In the manufacturing process of the array substrate, the wiring width of the part where the scanning line intersects the auxiliary capacitor line voltage supply line in the scanning line is narrowed, and at the same time the area of ​​the part where the scanning line intersects with the auxiliary capacitor line voltage supply line is reduced, and the Small wiring capacitance, reducing the time constant of the scanning line, expanding the wiring width of the part of the auxiliary capacitor line that crosses the voltage supply line of the auxiliary capacitor line, shortening the distance between the adjacent scanning line and the closest part of the auxiliary capacitor line, making the manufacturing process, etc. The electrostatic charge generated in the process is discharged in the closest part to prevent the electrostatic damage in the manufacturing process from causing defective products.

Description

technical field [0001] The invention relates to a fine wiring structure and a wiring method of an active matrix type liquid crystal display device. Background technique [0002] In recent years, the mainstream of liquid crystal display devices is an active matrix liquid crystal display device having a thin film transistor (Thin Film Transistor, TFT). Along with the enlargement and high-definition of display screens, in such active matrix liquid crystal display devices, the number of pixels of each display device is increasing, and at the same time, the arrangement pitch of pixel electrodes is also becoming finer year by year. [0003] In this situation, in order to reduce the manufacturing cost of the TFT array substrate, it is necessary to maintain and improve the manufacturing yield even when the arrangement pitch of the pixel electrodes on the TFT array substrate becomes finer. Manufacturing failure caused by electrostatic damage in the manufacturing process is a situati...

AI Technical Summary

Problems solved by technology

[0005] However, even with the above-mentioned short ring, it is impossible to prevent electrostatic damage in the manufacturing process before the short ring is formed and after the short ring is removed.

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