Historical trend analysis method for infrared sequence image

A technology of sequential images and historical trends, applied in the field of historical trend analysis, can solve problems such as low efficiency and unsatisfactory applications

Inactive Publication Date: 2008-04-23
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the current infrared software, if the user needs to observe and record the equipment for a long time, they can only manually mark the points of interest and use other means to record. The advantage of "surface scanning", the thermal imager is degraded to the function of a spot thermometer for use
The current application cannot meet the needs of users who analyze the historical process of equipment temperature changes and draw historical curves

Method used

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  • Historical trend analysis method for infrared sequence image
  • Historical trend analysis method for infrared sequence image
  • Historical trend analysis method for infrared sequence image

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Embodiment Construction

[0019] Combine the following figure 1 Describe the flow of the present invention:

[0020] The applicant has realized the infrared file management function in the infrared analysis software of the computer. The user can classify and manage the infrared thermal images taken in different periods in the analysis software, and organize the images of the equipment to be analyzed in different periods into one analysis file through this function. Secondly, through the positioning points manually input by the user, use affine, projection or quadratic transformation matrix to perform geometric correction operations on these images, and register these images according to the spatial position of the reference image. The user can then take advantage of the thermal imager's "surface scan" to search and pick points of interest on the image, and the software automatically displays a graph of the device's temperature change at this spatial point over time. Finally, the user can import the te...

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Abstract

This invention relates to infrared sequence image history trend analysis method and belongs to device fault diagnose field. This invention comprises the following steps: first to collect the infrared heat images caught in different periods of the device to be measured into one analysis file fold; second to input position points by human and use artificial conversion matrix, project conversion matrix or quadrics conversion matrix; then to use double linear insert and correct the image by geometry and aligns it according to reference image space position; third to use the characteristics of side scanning of thermal imaging device to scan images to get the interest points position and temperatures and give and display the change curve in different temperature at the interest points.

Description

technical field [0001] The invention belongs to the field of equipment fault diagnosis, and provides a historical trend analysis method for equipment fault diagnosis using infrared sequence images. Background technique [0002] Infrared thermal imaging cameras and their image analysis software have been widely used in the field of infrared equipment fault diagnosis. In practice, the temperature measurement function of the infrared thermal imaging camera is mainly used to measure the temperature of the equipment and find the thermal fault of the equipment. Compared with the contact measurement method, the thermal imager is a non-contact on-line detection, that is, the on-line non-contact temperature measurement can be carried out without the equipment being shut down; is the temperature value of all points on a projection plane; and the results it gives are intuitive, and high and low temperature regions can be represented in an intuitive way through false color enhancement. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/00G06F3/00G06K9/20
Inventor 王晓宇陈吉红彭芳瑜黄植红
Owner HUAZHONG UNIV OF SCI & TECH
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