Nano-electrode-array for integrated circuit interconnects

Abstract

An integrated circuit is provided including an integrated circuit having a trench and via provided in a dielectric layer. A nano-electrode-array is over the dielectric layer in the trench and via, and a conductor is over the nano-electrode-array. The conductor and the nano-electrode-array are coplanar with a surface of the dielectric layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) [0001] This is a Divisional of co-pending application Ser. No. 10 / 990,273 filed Nov. 15, 2004, which is hereby incorporated by reference herein.TECHNICAL FIELD [0002] The present invention relates generally to semiconductor technology and more specifically to integrated circuit interconnects. BACKGROUND ART [0003] In integrated circuits, transistors are made on a semiconductor substrate and connected together using integrated circuit interconnects. This process is performed using a number of different photolithographic, deposition, and removal processes to create contacts to the transistors, trenches to the contacts, and vias interconnecting the trenches where there are more than one level of channels. [0004] Generally, a device dielectric layer is deposited over the transistors, openings are formed through the device dielectric layer down to transistor junctions and gates, and the openings are filled with a conductive metal to form contacts...

AI Technical Summary

Problems solved by technology

This diffusion can result in a conductive buildup and cause short circuits in the integrated circuits.

A problem exists in forming very thin layers of a uniform thickness for integrated circuits.

A problem occurs with high resistance in the interconnects with decreasing size which reduce the advantage of using high conductivity materials, such as copper, which are desirable for high speed and high reliability interconnections.

A problem occurs with proper deposition on porous ultra low dielectric constant materials coming into use.

Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

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