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Electronic module and method for the production thereof

A technology of electronic components and electronic components, which is applied in the direction of printed circuit manufacturing, electrical components, printed circuits connected with non-printed electrical components, etc., and can solve problems such as high cost and single board thickness

Inactive Publication Date: 2007-02-28
BSH BOSCH & SIEMENS HAUSGERAETE GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of producing such assemblies with the method known from the prior art is that the mechanically connected individual boards stacked together are too thick after all, and this method is rather costly

Method used

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  • Electronic module and method for the production thereof
  • Electronic module and method for the production thereof
  • Electronic module and method for the production thereof

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Embodiment Construction

[0032] FIG. 1 shows the concealed side 5 of a preferred embodiment of an electronic component 1 . The embodiment shown here relates to a first variant of the assembly 1 in which the wave soldering area 20 of the SMD component 2 on one SMD area 19 and the THD component 4' arranged on the appliance side 7 is located on the concealed side 5.

[0033] FIG. 2 shows the appliance side 7 of the first preferred embodiment of the electronic assembly 1 corresponding to the concealed side 5 shown in FIG. 1 . On the electrical side 7, both SMD components 4 and THD components 4' are provided, wherein the THD component 4' is arranged on the THD area 20' of the electrical side 7, which is exactly the same as the wave soldering area 20 of the concealed side 5 relatively. The SMD components 4 can be arranged on the appliance side 7 both in the THD region 20' and in the SMD region 19'. The SMD area 19' on the electrical side 7 is exactly opposite to the SMD area 19 on the concealed side 5.

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PUM

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Abstract

The invention relates to an electronic module (1) comprising at least one circuit carrier (3) coated on both sides with an electroconductive material and fitted with a first group of electronic components (2, 2') for forming a user interface and a second group of electronic components (4, 4') for forming a computing and control module. The invention also relates to a method for producing one such module (1). According to said method, the components (2, 2', 4, 4') are carefully arranged respectively on the cover side (5) and on the appliance side (7) of the module (1) in such a way that the design and function of the module (1) can be completely unrelated. In order to reduce the production costs of the inventive module, printed circuit boards coated on both sides are used as circuit carriers (3) that are free of STH through-connection points. According to the invention, the signal transmission is carried out via plug-in elements (8), lateral elements (9), and through-connection elements (10).

Description

technical field [0001] The invention relates to an electronic assembly having at least one circuit board coated on both sides with an electrically conductive material, provided with a first group of electronic components forming a user interface and a second group forming a calculation and control module Electronic components; moreover, the invention relates to a method of manufacturing such components. Background technique [0002] Electronic assemblies of the above-mentioned kind and their corresponding manufacturing methods are well known in the printed circuit board assembly art. The choice of printed circuit board base material is very important for the manufacture of the corresponding electronic components, because the base material used jointly determines to a large extent the electrical, mechanical and high-frequency performance of the printed circuit board to be manufactured and the usable Manufacturing methods and expected manufacturing costs. Therefore, the corr...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/40
CPCH05K2201/09972H05K2201/10356H05K3/4046H05K2201/10446H05K2203/1572H05K1/18H05K2201/10189H05K2201/10295Y10T29/4913H05K1/181
Inventor M·格拉德尔L·克诺普R·施泰内格尔
Owner BSH BOSCH & SIEMENS HAUSGERAETE GMBH
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