NiCrOxNy solar spectrum selective absorbing thin-membrane and preparing method thereof
A technology of absorbing film and solar spectrum, which is applied in NiCrOXNY solar spectrum selective absorbing film and preparation field, can solve the problems that vacuum tubes cannot be made into building blocks, increase the demand for solar spectrum selective film heat absorbing board core, etc.
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Embodiment 1
[0014] Operation steps: Use mechanical and chemical methods to remove the contamination layer and oxide layer on the surface of the copper plate core - Place the copper plate core on the sample holder of the magnetron sputtering machine - Vacuumize and bake to improve the vacuum quality, set the baking temperature to 90°C, The background vacuum reaches 5×10 -3 Pa-Introduce 60 sccm of Ar gas through the mass flow meter, adjust the vacuum degree of the vacuum chamber to 0.5Pa, turn on the target power supply, target voltage 420V, current 5A, pre-sputtering target surface cleaning treatment, about 15 minutes to 20 minutes-revolving sample Stand and pass oxygen 15sccm, nitrogen 30sccm, keep the sputtering working pressure at 0.5Pa, current 5A, sputter for 5 minutes - pass oxygen 20sccm, nitrogen 30sccm, keep the sputtering working pressure at 0.5Pa, current 5A, sputter for 5 minutes -- pass Oxygen 30sccm, stop nitrogen, keep sputtering working pressure 0.8Pa, current 5A, sputterin...
Embodiment 2
[0020] Operation steps: Use mechanical and chemical methods to remove the contamination layer and oxide layer on the surface of the copper plate core - Place the copper plate core on the sample holder of the magnetron sputtering machine - Vacuumize and bake to improve the vacuum quality, set the baking temperature to 90°C, The background vacuum reaches 5×10 -3 Pa-Introduce 60 sccm of Ar gas through the mass flow meter, adjust the vacuum degree of the vacuum chamber to 0.5Pa, turn on the target power supply, target voltage 420V, current 5A, pre-sputtering target surface cleaning treatment, about 15 minutes to 20 minutes-revolving sample Stand and pass oxygen 12sccm, nitrogen 30sccm, keep sputtering working pressure at 0.5Pa, current 5A, sputter for 6 minutes - pass oxygen at 18sccm, nitrogen 30sccm, keep sputtering working pressure at 0.5Pa, current 5A, sputter for 7 minutes--on Oxygen 25sccm, stop nitrogen flow, keep sputtering working pressure 0.8Pa, current 5A, sputtering fo...
Embodiment 3
[0026] Use mechanical and chemical methods to remove the contamination layer and oxide layer on the surface of the copper plate core - place the copper plate core on the sample holder of the magnetron sputtering machine - vacuumize and bake to improve the vacuum quality, set the baking temperature to 90°C, and the background vacuum up to 5×10 -3 Pa-Introduce 60 sccm of Ar gas through the mass flow meter, adjust the vacuum degree of the vacuum chamber to 0.5Pa, turn on the target power supply, target voltage 420V, current 5A, pre-sputtering target surface cleaning treatment, about 15 minutes to 20 minutes-revolving sample Set up and pass nitrogen 30sccm unchanged, gradually pass oxygen from 0 to 30sccm, increase 3sccm per minute, keep sputtering working pressure 0.5Pa, current 5A, sputtering for 10 minutes--stop nitrogen flow, keep 35sccm oxygen flow to keep sputtering work Air pressure 0.8Pa, current 5A, sputtering for 10 minutes - shutdown
[0027] Technical indicators:
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