Three-dimensional ultrasonic imaging non-destructive inspection system
A three-dimensional ultrasonic and non-destructive flaw detection technology, which is used in material analysis, image data processing, and 3D image processing using sonic/ultrasonic/infrasonic waves. It can achieve the objective of detection results, avoid subjectivity, and achieve the effect of practical and comprehensive detection.
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[0014] Below in conjunction with accompanying drawing, the present invention is described in further detail:
[0015] The present invention is made up of three major parts.
[0016] The first part is a computer platform (11), i.e. a general-purpose computer platform, including a bus (6) providing channels for various information transmissions. The computing power of the CPU used by the general-purpose microcomputer should be as large as possible (each channel needs Pentium III 1GMHz or equivalent computing power) to meet the requirements of increasing the number of channels; the motherboard used should use standard 32-bit or 64-bit PCI Bus, the frequency of PCI can be selected not less than 33MHz (such as 33MHz, 66MHz or 100MHz or even higher) to meet the requirements of multi-channel high data transmission rate, and the number of PCI slots on it should not be less than 4 to adapt to multi-channel The motherboard should support disk array RAID; the memory should be no less th...
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