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Three-dimensional ultrasonic imaging non-destructive inspection system

A three-dimensional ultrasonic and non-destructive flaw detection technology, which is used in material analysis, image data processing, and 3D image processing using sonic/ultrasonic/infrasonic waves. It can achieve the objective of detection results, avoid subjectivity, and achieve the effect of practical and comprehensive detection.

Inactive Publication Date: 2004-01-21
许水霞
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, in my country, the detection of internal defects of industrial equipment and product parts is still generally performed manually (that is, the one-dimensional ultrasonic system), and it is impossible to talk about synchronous detection and monitoring with production. Some units have also developed the probe plane and rotary scanning flaw detection technology. Or helical scanning technology, some units use phased array technology for plane scanning, but these are only scanned images of a certain side, which are far from three-dimensional imaging, and complete post-processing of spatial information has not been realized, so it is difficult to ensure that information is not missing , no loss and correct judgment, let alone data exchange with other systems, to find out the cause of defects inside parts in time; on the other hand, medical three-dimensional ultrasonic imaging technology, such as patent No. 99125811.8, patent No. It is far from the detection target, acoustic characteristics and technical requirements of industrial non-destructive testing technology, so it cannot be transplanted

Method used

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Embodiment Construction

[0014] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0015] The present invention is made up of three major parts.

[0016] The first part is a computer platform (11), i.e. a general-purpose computer platform, including a bus (6) providing channels for various information transmissions. The computing power of the CPU used by the general-purpose microcomputer should be as large as possible (each channel needs Pentium III 1GMHz or equivalent computing power) to meet the requirements of increasing the number of channels; the motherboard used should use standard 32-bit or 64-bit PCI Bus, the frequency of PCI can be selected not less than 33MHz (such as 33MHz, 66MHz or 100MHz or even higher) to meet the requirements of multi-channel high data transmission rate, and the number of PCI slots on it should not be less than 4 to adapt to multi-channel The motherboard should support disk array RAID; the memory should be no less th...

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Abstract

The three-dimensional ultrasonic imaging non-destructive inspection system is used in detecting, locating, quantifying and classifying faults inside industrial products including components and parts, and its measurement data may be exchanged with other system for searching cause of the faults and improving quality. Structurally, it has ultrasonic system, electromechanical executing system, A / D system, signal processing system, 3D display system, automatic control system and timing system installed on a computerized platform. During operation, the ultrasonic system sends out ultrasonic pulse to workpiece and receives the echo, the A / D system processes the echo signal and converts into digital signal fed to the computer, the signal processing system establishes the 3D data base of faults, and the 3D display system displays the 3D ultrasonic image with its 3D figure display software.

Description

(1) Technical field [0001] The invention relates to an ultrasonic imaging detection technology in the field of nondestructive flaw detection, in particular to a three-dimensional ultrasonic imaging nondestructive flaw detection system for detecting and monitoring internal defects of industrial equipment and product components. (2) Background technology [0002] At present, in my country, the detection of internal defects of industrial equipment and product parts is still generally performed manually (that is, the one-dimensional ultrasonic system), and it is impossible to talk about synchronous detection and monitoring with production. Some units have also developed the probe plane and rotary scanning flaw detection technology. Or helical scanning technology, some units use phased array technology for plane scanning, but these are only scanned images of a certain side, which are far from three-dimensional imaging, and complete post-processing of spatial...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/00G06T15/00
Inventor 许水霞
Owner 许水霞
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