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Computer system including co-planar processor connector

A technology of computer system and small shape, which is applied in the field of computer system and can solve the problems of restricting small shape

Inactive Publication Date: 2007-08-08
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first generation SECC processor package was connected to the motherboard by two parts occupying orthogonal planes, which, as a result, limited the small form factor achievable possibilities

Method used

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  • Computer system including co-planar processor connector
  • Computer system including co-planar processor connector
  • Computer system including co-planar processor connector

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Embodiment Construction

[0012] Various aspects of the invention are described in the following description. Those skilled in the art will appreciate that the invention may be practiced with only some of these aspects or with all of the aspects of the invention. For purposes of explanation, specific numbers, materials and configurations are given in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known features were omitted or simplified in order not to clarify the present invention.

[0013] Referring now to FIGS. 1a-1b, there are shown side and top views of an exemplary motherboard with a processor package attached thereto in accordance with the principles of the present invention. As shown, processor package 208 is connected to motherboard 202 using processor coplanar connector 402 of the present invention in accordance with the p...

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Abstract

A computer system is formed using a co-planar processor connector to connect a motherboard and a processor package together in a co-planar manner. The co-planar processor connector includes a planar body having an inner cavity defined a number of inner walls extending from one end to the other end, and a number of pins disposed on the inner walls, extending from one end to the other end. The co-planar connector engages the motherboard at one end, and the processor package at the other end. The pins electrically couple the processor package to the motherboard.

Description

technical field [0001] The present invention relates to the field of computer systems. More specifically, the present invention relates to techniques for connecting processors to computer system motherboards. Background technique [0002] Microprocessor-based personal computers are well known in the art, including those using small form factors. Traditionally, small form factor personal computers have used zero insertion force (ZIF) sockets to connect the processor to the motherboard. In the past, the way processors are connected to motherboards has not needed to be addressed to achieve small form factors because processors generally had small form factors then. However, recent advances in microprocessor technology have led some high performance microprocessors to use "box" packaging schemes and Single Edged Card Connector (SECC) technology to connect the processor package to the motherboard. Because of the high performance nature of these processors, it is generally nece...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16G06F1/18
CPCG06F1/184H01R12/725H01R13/64
Inventor T·范
Owner INTEL CORP
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