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System and method for analyzing curvature and stress information of plate structure

A board structure and analysis board technology, applied in the measurement of the elastic deformation force of the measurement gauge, the analysis of materials, the measurement of force, etc., can solve the problems of unfavorable device performance and reliability, device failure, etc.

Inactive Publication Date: 2005-12-14
CALIFORNIA INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Stresses caused by these and other factors are detrimental to device performance and reliability, and can even lead to device failure

Method used

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  • System and method for analyzing curvature and stress information of plate structure
  • System and method for analyzing curvature and stress information of plate structure
  • System and method for analyzing curvature and stress information of plate structure

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Embodiment Construction

[0028] Involves stresses and associated curvature in homogeneous plates or multilayer structures. This correlation can be used to study the evolution of stress and curvature or the deformation of surfaces caused by stress. When the stress-induced out-of-plane deflection of the structure is small compared to the overall thickness of the structure, various approximation techniques can be used to obtain the correlation between curvature and stress. An example is Stoney's formula:

[0029] σ f = E bi h 2 6 h f K Stoney - - - ( 1 )

[0030] where σ r is on a substrate of thickness h with thickness h f ' uniform equibiaxial ...

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Abstract

Acceptance of large deformations for determining layered or graded structures (1710), including body forces such as gravitational, electrostatic or electromagnetic forces, and other forces, support forces, and concentrations uniformly distributed over the structure (p) The action of the force (P). A real-time stress monitoring system (1700) is also disclosed to provide in situ monitoring of devices based on large deformation analysis methods. For example, a coherent gradient sensing module (1730) may be included in such a system.

Description

[0001] This application claims the benefit of provisional application US Serial No. 60 / 293,562, filed May 25, 2001, the disclosure of which is hereby incorporated by reference in its entirety. Background technique [0002] The present application relates to the measurement and analysis of stresses in devices fabricated with features on substrates. [0003] A substrate formed of a suitable solid material can be used as a platform to support different structures such as large panels with layered structures or coatings formed thereon and microstructures integrated on the substrate. Examples include large panels which include aeronautical and marine components and structures. For example, a substrate-based integrated device having one or more layers or films, one or more layers or films, including integrated electronic circuits, integrated optical devices, micro-electro-mechanical systems, flat-panel display systems, or any of the above-mentioned devices A combination of two or m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/00G01L1/04G01L1/00G01B11/16G01B11/24G01B11/255G01B21/32
CPCG01B11/16G01B11/161G01B21/32G01L1/00
Inventor S·苏雷什I·布莱赫A·J·罗赛克斯A·吉纳科珀洛斯
Owner CALIFORNIA INST OF TECH
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