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Photoelectric sensor and packaging method thereof

A technology of photoelectric sensor and packaging method, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problem that photoelectric sensors cannot take into account the detection accuracy and process difficulty at the same time, achieve both detection accuracy and process difficulty and production cost, and increase incident Light, the effect of increasing the intensity of the light signal

Pending Publication Date: 2022-07-29
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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  • Claims
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Problems solved by technology

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present invention is to provide a photoelectric sensor and its packaging method, aiming to solve the problem that the existing photoelectric sensors cannot take into account the detection accuracy and process difficulty at the same time.

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  • Photoelectric sensor and packaging method thereof
  • Photoelectric sensor and packaging method thereof
  • Photoelectric sensor and packaging method thereof

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Embodiment Construction

[0060] In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0062] With the development of photoelectric sensors, the application scenarios of photoelectric sensors...

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Abstract

The invention relates to a photoelectric sensor and a packaging method thereof. A plurality of photoelectric conversion chips distributed in an array are formed on a driving substrate; forming a protection unit wrapping each photoelectric conversion chip on the driving substrate; forming an isolation structure between the adjacent protection units on the driving substrate; forming a filtering unit on each protection unit; forming a lens unit on each filtering unit; a single photoelectric sensor is formed. The photoelectric sensor is internally provided with the photoelectric conversion chip arrays, the isolation structures located between the adjacent photoelectric conversion chips, and the filtering unit arrays and the lens unit arrays which are respectively arranged corresponding to the photoelectric conversion chip arrays, so that quantitative analysis can be realized, the process difficulty is low, the cost is also low, and higher application requirements of users on the photoelectric sensor are met; and the user experience is improved.

Description

technical field [0001] The invention relates to the field of photoelectric sensors, in particular to a photoelectric sensor and a packaging method thereof. Background technique [0002] With the development of photoelectric sensors, the application scenarios of photoelectric sensors are becoming more and more extensive, such as using photoelectric sensors to realize proximity light detection or ambient light detection. The existing photoelectric sensor packaging forms are as follows: figure 1 As shown, an existing photoelectric sensor packaging form is: the photodiode chip 300 is fixed on the bracket 100 by the fixing glue 200, and the filter sealant 400 is formed on the photodiode chip 300, so as to realize the selectivity of the signal by the filter sealant Filter to receive bands for light intensity monitoring purposes. When this scheme is adopted, the filter range will change due to the long-term aging and deterioration of the glue, and there is a defect that the filte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/0203H01L31/0232H01L31/0216H01L31/102
CPCH01L31/18H01L31/0203H01L31/02165H01L31/02325H01L31/102
Inventor 张志超苏运冠
Owner SHENZHEN JUFEI OPTOELECTRONICS CO LTD
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