Semiconductor packaging mold

A semiconductor and mold technology, applied in the field of semiconductor packaging molds, can solve the problems of cumbersome operation, low degree of automation of semiconductor packaging, and reduced efficiency of semiconductor packaging, so as to achieve the effects of increasing automation, facilitating replacement, and improving packaging efficiency

Inactive Publication Date: 2022-05-24
苏永辉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a semiconductor packaging mold, through the design of the drive mechanism, transmission assembly, packaging assembly, screw screw assembly, screw supply assembly and push assembly, it solves the problem that the existing semiconductor packaging mold always needs in the packaging process. Manually place the screws on the bottom of the packaging mold, and then realize the tightening and fixing of the screws on the packaging box. The operation is cumbersome, which greatly reduces the packaging efficiency of semiconductors, and the automation of semiconductor packaging is low.

Method used

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  • Semiconductor packaging mold
  • Semiconductor packaging mold
  • Semiconductor packaging mold

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Embodiment 1

[0035] see Figure 1-13 , the present invention is a semiconductor packaging mold, including a drive mechanism 1, the drive mechanism 1 includes a mounting base 101 and a concave support frame 102 fixed on the top of the mounting base 101, the top of the mounting base 101 is fixed with a limit ring 103, through the limit The arrangement of the ring 103 enables the packaging box containing the semiconductor material to be confined inside the limiting ring 103, thereby preventing the position of the packaging box from moving during the packaging process;

[0036] A No. 1 stepping motor 104 is installed on the top of the concave support frame 102 , a clamping piece is fixed at the lower end of the output shaft of the No. 1 stepping motor 104 , a transmission component 2 is sleeved outside the clamping piece, and a package component 3 is rotatably connected to the bottom of the transmission component 2 . The four corners of the surface of the package assembly 3 are rotatably conne...

Embodiment 2

[0051] On the basis of Embodiment 1, according to the use of screws 5 in different types of grooves on the packaging box, the corresponding type of screw screw assembly 4 can be replaced to meet the needs of tightening and fixing the screws 5 on the packaging box.

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PUM

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Abstract

The invention discloses a semiconductor packaging mold, and relates to the related technical field of semiconductors. A packaging assembly is rotationally connected to the bottom of a transmission assembly, and screw screwing assemblies engaged with the transmission assembly are rotationally connected to the four corners of the surface of the packaging assembly; two intermittent moving screw supply assemblies are arranged in the mounting base in a sliding fit mode. Screw taking holes located in the inner sides of the limiting rings are formed in the four corners of the top of the mounting base correspondingly, and the screw screwing assembly sucks screws on the screw supply assembly to the bottom of the screw screwing assembly through the screw taking holes. The screws are magnetically adsorbed on the screw screwing assembly, after the packaging assembly moves downwards to the position where the screws are attached to the packaging holes in the packaging box, the screws at the four corners are driven to rotate through rotation of the transmission assembly at the same time, and then screwing and fixing of the screws on the packaging box are achieved; and under the elastic restoring force of the elastic resetting piece, the packaging assembly moves upwards and is reset, so that the packaging efficiency of the semiconductor is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor packaging mold. Background technique [0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement, such as diodes. [0003] When a semiconductor is produced and shipped, it is usually necessary to package the semiconductor, so as to ensure that the semiconductor will not be damaged during subsequent transportation and sales. At present, when packaging semiconductors, the semiconductors are usually stacked in a packaging box, and then the packaging box cover is fixed on the packaging box. By arranging screws on the four corners of the packaging box cover, the stable packaging of the semiconductor is realized. [0004] However, in the process of implementing the specific embodiments of the present inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/68
CPCH01L21/565H01L21/68
Inventor 苏永辉
Owner 苏永辉
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