Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Superelastic micro-nano energy acquisition and sensing integrated microsystem, manufacturing method and use method

A super-elastic, micro-system technology, applied in electrical components, triboelectric generators, electromechanical devices, etc., can solve the problems of low integration, single function, restricting the development and practical application of wearable electronic devices and equipment, and achieve the goal of improving electrical Output, the effect of improving the effective permeability

Active Publication Date: 2022-04-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at this stage, the key and difficulty in realizing a flexible wearable smart microsystem is how to integrate a variety of flexible wearable single-function modules into one, which has a single function and low integration, which greatly limits the application of wearable electronic devices and equipment. Further development and practical application

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Superelastic micro-nano energy acquisition and sensing integrated microsystem, manufacturing method and use method
  • Superelastic micro-nano energy acquisition and sensing integrated microsystem, manufacturing method and use method
  • Superelastic micro-nano energy acquisition and sensing integrated microsystem, manufacturing method and use method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] In the description of the present invention, it should be noted that the terms belonging to "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated direction or positional relationship is based on the direction or positional relationship described in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
widthaaaaaaaaaa
distanceaaaaaaaaaa
Login to View More

Abstract

The invention discloses a hyperelastic micro-nano energy acquisition and sensing integrated microsystem, a manufacturing method and a use method. The microsystem comprises an elastic substrate, a flexible circuit board coil, a deformation body, a conductive permanent magnet and a packaging layer, the elastic substrate is located at the bottom of the deformation body, the packaging layer is located at the top of the deformation body, a first space for placing a flexible circuit board coil is formed between the elastic substrate and the deformation body, and a second space for placing a conductive permanent magnet is formed between the packaging layer and the deformation body; the flexible circuit board coil and the conductive permanent magnet are externally connected with power supply equipment, and / or the flexible circuit board coil is externally connected with excitation alternating current. According to the super-elastic micro-system integrating micro-nano energy acquisition and sensing, the friction part and the electromagnetic part both have good electrical property output; and meanwhile, an active electromagnetic motion sensing function based on an electromagnetic induction law and / or a passive inductive pressure sensing function based on an eddy current effect (an expression form of an electromagnetic induction effect) are / is realized.

Description

technical field [0001] The invention relates to the field of wearable intelligent microsystems, in particular to a superelastic micro-nano energy collection and sensing integrated microsystem, a manufacturing method and a using method. Background technique [0002] In recent years, wearable electronic devices, as an emerging electronic industry, have become an important part of the Internet of Things and penetrate into all aspects of people's lives, including commercial operations, national defense security, medical health, sports assistance, etc. With the rapid development of Internet of Things technology, wearable electronic devices show a trend of multi-functional and intelligent integration, and put forward higher requirements for the flexibility and attachment of wearable electronic devices. [0003] Therefore, many researchers are committed to the development of flexible wearable smart microsystems, expecting to realize the integrated integration of energy harvesting +...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H02N1/04H02K33/02H02K33/18
Inventor 张晓升邓海涛张新然文丹良刘婧蕊夏易璇张语芯
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products