Superelastic micro-nano energy acquisition and sensing integrated microsystem, manufacturing method and use method

Abstract

The invention discloses a hyperelastic micro-nano energy acquisition and sensing integrated microsystem, a manufacturing method and a use method. The microsystem comprises an elastic substrate, a flexible circuit board coil, a deformation body, a conductive permanent magnet and a packaging layer, the elastic substrate is located at the bottom of the deformation body, the packaging layer is located at the top of the deformation body, a first space for placing a flexible circuit board coil is formed between the elastic substrate and the deformation body, and a second space for placing a conductive permanent magnet is formed between the packaging layer and the deformation body; the flexible circuit board coil and the conductive permanent magnet are externally connected with power supply equipment, and/or the flexible circuit board coil is externally connected with excitation alternating current. According to the super-elastic micro-system integrating micro-nano energy acquisition and sensing, the friction part and the electromagnetic part both have good electrical property output; and meanwhile, an active electromagnetic motion sensing function based on an electromagnetic induction law and/or a passive inductive pressure sensing function based on an eddy current effect (an expression form of an electromagnetic induction effect) are/is realized.

Description

technical field [0001] The invention relates to the field of wearable intelligent microsystems, in particular to a superelastic micro-nano energy collection and sensing integrated microsystem, a manufacturing method and a using method. Background technique [0002] In recent years, wearable electronic devices, as an emerging electronic industry, have become an important part of the Internet of Things and penetrate into all aspects of people's lives, including commercial operations, national defense security, medical health, sports assistance, etc. With the rapid development of Internet of Things technology, wearable electronic devices show a trend of multi-functional and intelligent integration, and put forward higher requirements for the flexibility and attachment of wearable electronic devices. [0003] Therefore, many researchers are committed to the development of flexible wearable smart microsystems, expecting to realize the integrated integration of energy harvesting +...

AI Technical Summary

Problems solved by technology

However, at this stage, the key and difficulty in realizing a flexible wearable smart microsystem is how to integrate a variety of flexible wearable single-function modules into one, which has a single function and low integration, which greatly limits the application of wearable electronic devices and equipment. Further development and practical application

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