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System, method and device for measuring two-dimensional/three-dimensional characteristics of back drilling hole

A three-dimensional feature and measurement system technology, applied in the field of optical measurement, can solve problems such as low detection efficiency and poor precision, and achieve the effect of improving production efficiency, improving work efficiency, and increasing market competition rate

Pending Publication Date: 2022-02-25
SHENZHEN EAGLE EYE ONLINE ELECTRONICS TECH
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Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of this application is to provide a two-dimensional / three-dimensional feature measurement system for back-drilled holes, which aims to solve the problems of roundness and back-drilled height of circuit board back-drilled holes in existing detection systems. Problems of low efficiency and poor precision

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  • System, method and device for measuring two-dimensional/three-dimensional characteristics of back drilling hole
  • System, method and device for measuring two-dimensional/three-dimensional characteristics of back drilling hole
  • System, method and device for measuring two-dimensional/three-dimensional characteristics of back drilling hole

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Embodiment Construction

[0035] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0036] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments that the present application can be used to implement. The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direc...

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Abstract

The invention relates to a system for measuring the two-dimensional / three-dimensional characteristics of a back drilling hole. The system comprises an image acquisition device which moves at equal intervals through a motion platform to acquire a two-dimensional real-time image and a three-dimensional actual height image of a circuit board with the back drilling hole; a position acquisition device performs fixed threshold segmentation on the two-dimensional real-time image of the circuit board with the back drilling holes to obtain position information of each back drilling hole in the two-dimensional real-time image; a back drilling hole center extraction device obtains an area-of-interest image of the position where each back drilling hole is located according to the position where each back drilling hole is located in the two-dimensional real-time image; a back drilling hole inner and outer boundary processing device performs double threshold segmentation according to the center of the back drilling hole to obtain inner and outer boundaries of the back drilling hole, and obtains the position relation between the circle centers of the inner and outer boundaries and the inner and outer boundaries; and a characteristic parameter generating device calculates the characteristic parameters of the back drilling hole on the three-dimensional actual height image. The invention further discloses a back drilling hole two-dimensional / three-dimensional characteristic measuring method and a back drilling hole two-dimensional / three-dimensional characteristic measuring device.

Description

technical field [0001] The invention relates to the technical field of optical measurement, in particular to a back-drilled two-dimensional / three-dimensional feature measurement system, a back-drilled two-dimensional / three-dimensional feature measurement method, and a back-drilled two-dimensional / three-dimensional feature measurement device . Background technique [0002] As a substrate carrying electronic components, circuit boards are widely used in the electronic field. Due to the wiring requirements of different electronic products, the main structural classification of circuit boards can be divided into two major blocks. One is divided according to the number of layers, which can be divided into single Panel, double-sided board, multi-layer board, flexible board; the second is divided according to the production process, which can be divided into copper board, tin-plated board, halogen-free board, immersion gold board, nickel-plated board, aluminum board, etc. Among th...

Claims

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Application Information

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IPC IPC(8): G06T7/73G06T7/66G06T7/13G06T7/136G06F17/10G01B11/00G01B11/24
CPCG06T7/73G06T7/66G06T7/136G06T7/13G06F17/10G01B11/24G01B11/00G06T2207/10004G06T2207/10012G06T2207/20004G06T2207/20104G06T2207/30108
Inventor 雷志辉陈状周翔郑如寿李秀懂傅丹
Owner SHENZHEN EAGLE EYE ONLINE ELECTRONICS TECH
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