Sensor packaging structure

A packaging structure and sensor technology, applied in the direction of electric solid-state devices, semiconductor devices, radiation control devices, etc., can solve the problems of excessively long wire arc, easy wire breakage, wire breakage, etc., and achieve the goal of reducing the probability of wire breakage Effect

Pending Publication Date: 2021-12-21
TONG HSING ELECTRONICS IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since there is a height difference between the substrate and the sensing chip, a plurality of the wires are prone to disconnection.
Furthermore, when the thickness of the sensing chip increases, the height difference also increases, which leads to a plurality of wire arcs that are too long and are more likely to be broken.

Method used

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Examples

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Embodiment 1

[0028] see figure 1 and figure 2 As shown, it is Embodiment 1 of the present invention. The present embodiment discloses a sensor packaging structure 100, which includes a substrate 1, a sensing chip 2 and a pad layer 3 mounted on the substrate 1 at intervals, located between the sensing chip 2 and the A filling body 4 between the pad layers 3, a plurality of wires 5 connecting the sensing chip 2 and the pad layer 3, a support body 6 arranged on the sensing chip 2 and the pad layer 3 , a light-transmitting layer 7 disposed on the support body 6 , and a packaging body 8 formed on the substrate 1 and surrounding the above-mentioned components.

[0029] Wherein, although the sensor package structure 100 is described as including the above-mentioned components in this embodiment, the sensor package structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the sensor packaging structure...

Embodiment 2

[0045] see image 3 and Figure 4 As shown, it is the second embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment are roughly described as follows:

[0046] In this embodiment, the pad layer 3 is not ring-shaped, and the sensor package structure 100 further includes a sealing layer 9 disposed on the first board surface 11, and the sealing layer 9 and the sealing layer 9 The pad layers 3 are connected together to form a ring structure and surround the outer side of the sensing chip 2 . Wherein, the sealing layer 9 is not electrically connected to the substrate 1 and the sensing chip 2, and the top edge of the sealing layer 9 is coplanar with the top edge 31 of the pad layer 3 and the sensing chip. The top surface 21 of the measuring chip 2.

[0047] Further, the sealing layer 9 may be arranged...

Embodiment 3

[0050] see Figure 5 to Figure 7 As shown, it is the third embodiment of the present invention. Since this embodiment is similar to the above-mentioned second embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the second embodiment are roughly described as follows:

[0051] In this embodiment, the sealing layer 9 can also be connected to the outer edge 22 of the sensing chip 2, so the filler 4 is only formed between the sensing chip 2 and the pad layer 3 between. The supporting body 6 is ring-shaped and formed on the top edge 31 of the cushion layer 3, the top edge of the sealing layer 9, the top surface 21 of the sensing chip 2, and the filling The top edge 41 of the body 4. Moreover, the support body 6 is not in contact with the sensing region 211 of the sensing chip 2, the outer edge 35 of the pad layer 3, and the outer edge of the sealing layer 9, but the present invention is not limited thereto...

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PUM

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Abstract

The invention discloses a sensor packaging structure. The sensor packaging structure comprises a substrate, a sensing chip, a heightening layer, a plurality of wires, a supporting body and a light-transmitting layer, wherein the sensing chip and the heightening layer are mounted on the substrate; the light-transmitting layer is arranged on the supporting body; the top edge of the heightening layer is electrically coupled with the substrate and is coplanar on the top surface of the sensing chip; the supporting body is arranged on the top edge of the heightening layer and the top surface of the sensing chip; and the plurality of wires are completely embedded in the supporting body. One end of each of the plurality of wires is connected to the top surface of the sensing chip, and the other end of each of the plurality of wires is connected to the top edge of the heightening layer, so that the sensing chip is electrically coupled to the substrate through the plurality of wires and the heightening layer. The sensing chip can be electrically coupled to the substrate through the plurality of wires and the heightening layer, so that the influence of the height segment difference between the substrate and the sensing chip on the plurality of wires is reduced.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a sensor packaging structure. Background technique [0002] A conventional sensor packaging structure includes a substrate, a sensing chip disposed on the substrate, and a plurality of wires connecting the substrate and the sensing chip. However, since there is a height difference between the substrate and the sensing chip, a plurality of the wires are prone to disconnection. Furthermore, when the thickness of the sensing chip increases, the height difference also increases, which leads to too long arcs of the plurality of wires and is more likely to be broken. [0003] Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14636H01L27/14634
Inventor 辛宗宪
Owner TONG HSING ELECTRONICS IND LTD
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