A cleaning method for vacuum cavity parts in chip coating process

Abstract

The invention discloses a cleaning method for vacuum cavity parts in a chip coating process, including (1) part masking: applying masking glue to the parts of aluminum parts without gold, and curing by standing; (2) de-gold: covering The aluminum parts after the masking glue has cured are immersed in the de-gold liquid, and left to stand for de-gold removal; (3) Cleaning: Rinse the de-gold aluminum parts with deionized water, and polish the solid impurities remaining on the surface of the aluminum parts; ( 4) Degumming cleaning: degumming the cleaned aluminum parts; (5) suction filtration: filtering the degold liquid after degumming to obtain a degumming liquid containing gold, and adding a reducing agent to the degumming liquid to extract gold , the bottom slag is dissolved in aqua regia, and then nitrified reduction is carried out, and a reducing agent is added to extract gold. The present invention improves the activity of potassium hydroxide and potassium iodide by improving the formula of the gold removal solution and utilizes the combined action of the gold removal accelerator and sodium lauryl sarcosinate. Compared with the prior art, the invention has the advantages of gold removal. The speed is fast, and it does not corrode the aluminum substrate.

Description

technical field [0001] The invention belongs to the technical field of parts cleaning, and relates to a cleaning method for vacuum cavity parts in a chip coating process. Background technique [0002] The chip coating process involves a process of physical vapor film deposition, the purpose of which is to attach a layer of metal film on the surface of the chip, so that the chip can realize the conductive function. A kind of equipment used in the process is called physical vapor film deposition equipment, also called PVD coating equipment. During the process, more and more metal will be attached to the vacuum chamber of the PVD coating equipment. After the metal is deposited too much, it will lead to spalling, slag drop, etc., which will affect the stability of the coating process. Therefore, after a period of time, the parts of the vacuum chamber need to be cleaned of metal deposits before production can continue. [0003] At present, the vacuum chamber parts in the chip c...

AI Technical Summary

Problems solved by technology

[0003] At present, the vacuum chamber parts in the chip coating process have aluminum as the base material, and metal gold is deposited on the surface of the aluminum parts. Due to the active chemical properties of aluminum, it is easy to cause The aluminum substrate is over-corroded and the degolding speed is slow. Therefore, it is urgent to develop a cleaning method that has a fast degolding speed, does not corrode the aluminum substrate, and does not damage the aluminum parts.