Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ink supply method

An ink supply and ink technology, applied in printing and other directions, can solve the problem of easily reducing the printing quality of inkjet print heads, and achieve the effect of reducing ink breakage and improving printing quality

Active Publication Date: 2021-10-26
SHENZHEN RUNTIANZHI DIGITAL EQUIP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present application is to provide an ink supply method to solve the technical problem that the circulation ink supply method in the prior art tends to reduce the printing quality of the inkjet print head

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ink supply method
  • Ink supply method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0026] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are for convenience o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an ink supply method. The ink supply method comprises the steps that a first sensor assembly obtains first temperature information and first negative pressure information of ink and transmits the first temperature information and the first negative pressure information to a controller, and a second sensor assembly obtains second temperature information and second negative pressure information of the ink and transmits the second temperature information and the second negative pressure information to the controller; a first difference value between the first temperature information and the second temperature information is calculated, the first difference value is compared with a first preset value, if the first difference value is larger than the first preset value, the controller controls a heater to reduce the power, and if the first difference value is smaller than the first preset value, the controller controls the heater to increase the power; and a second difference value between the first negative pressure information and the second negative pressure information is calculated, the second difference value is compared with a second preset value, if the second difference value is larger than the second preset value, the controller controls a circulating pump to reduce the power, and if the second difference value is smaller than the second preset value, the controller controls the circulating pump to increase the power. According to the ink supply method, the printing quality of an ink-jet printing head can be improved, and the situations of ink interruption, line pulling and the like of the ink-jet printing head are reduced.

Description

technical field [0001] The present application belongs to the technical field of inkjet printing, and more specifically relates to an ink supply method. Background technique [0002] The inkjet printing machine achieves ink circulation through high negative pressure and low negative pressure, that is, the ink flows from the low negative pressure chamber to the high negative pressure chamber, and then the circulation pump pumps the ink in the high negative pressure chamber to the low negative pressure chamber. or the high negative pressure sucks the ink at the low negative pressure into the high negative pressure cavity, and then the circulation pump pumps the ink in the high negative pressure cavity into the low negative pressure cavity to achieve the purpose of ink circulation , But the current way of circulating ink supply is usually easy to cause the inkjet print head to break the ink, pull the line, etc., thereby reducing the printing quality of the inkjet print head. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/18B41J2/175
CPCB41J2/18B41J2/17509B41J2/17566
Inventor 刘宏年马力徐星江洪
Owner SHENZHEN RUNTIANZHI DIGITAL EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com