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A multi-chip integrated circuit packaging structure

A technology of integrated circuit and packaging structure, which is applied in the field of multi-chip integrated circuit packaging structure, and can solve problems such as unstable connection and flow at the bottom of the pins

Active Publication Date: 2022-08-09
深圳市好年华电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the pins of the multi-chip integrated circuit packaging board are vertically downward, and the resin will flow after melting, if the resin coverage is large, it is easy for the molten resin to flow out to the edge to flow down along the pins to the bottom of the pin, resulting in unstable connection between the bottom of the pin and the circuit

Method used

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  • A multi-chip integrated circuit packaging structure
  • A multi-chip integrated circuit packaging structure
  • A multi-chip integrated circuit packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] For example figure 1 -example Figure 5 Shown:

[0029] The present invention provides a multi-chip integrated circuit packaging structure, the structure includes a fixing hole 1, an integrated circuit board 2, and a card slot 3, the fixing hole 1 is fixed on the upper surface position of the integrated circuit board 2, and the integrated circuit board 2 It is an integrated structure with the card slot 3; the integrated circuit board 2 includes an upper connection surface 21, a bottom plate 22, and pins 23, and the bottom of the upper connection surface 21 is in contact with the upper surface of the bottom plate 22. The pins 23 are fixed at the front end of the bottom plate 22 .

[0030] Wherein, the pin 23 includes an upper plate a1, an upper slide a2, a force rod a3, an elastic strip a4, and a collection frame a5. The upper plate a1 runs through the inner position of the collection frame a5, and the upper slide a2 The bottom is connected with the top of the force-b...

Embodiment 2

[0036] For example Image 6 -example Figure 9 Shown:

[0037] The board surface a24 includes a frame c1, a top slide bar c2, a slide plate c3, and a receiving plate c4. The frame c1 is embedded in the inner position of the receiving plate c4, and the top slide bar c2 is slidingly matched with the inside of the frame c1. , the sliding plate c3 is movably engaged with the inside of the frame c1, and the rebound force generated by the mechanism shrinking to the extreme can make the top sliding rod c2 slide upward along the frame c1 under the cooperation of the sliding plate c3, so that the top The sliding rod c2 can push away the resin solidified block that is not formed on the receiving plate c4.

[0038] The top slide bar c2 includes a side swing plate c21, a lower fixing plate c22, a pulling piece c23, and a middle connecting rod c24. The bottom of the side swing plate c21 is hingedly connected to the bottom of the middle connecting rod c24, and the pulling piece The c23 is ...

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Abstract

The invention discloses a multi-chip integrated circuit packaging structure. The structure includes a fixing hole, an integrated circuit board and a card slot. The fixing hole is fixed on the upper surface of the integrated circuit board. The integrated circuit board and the card slot are an integrated structure. The collection box on the pin can collect the molten resin flowing down the pin, and then the reverse thrust generated by the platform to the force rod on the pin can make the force rod produce an upward reverse thrust on the upper slide plate , so that the upper sliding plate can slide up along the inner wall of the collecting frame, so that the upper sliding plate can push up the solidified branch layer inside the collecting frame, and the upper sliding plate can be reset by the collision with the inner wall of the collecting frame. With the cooperation of the plate, it slides up and extends along the frame, so that the upper slide plate can push up the resin solidified block on the upper surface of the frame, which effectively avoids that the upper push rod is not easy to effectively remove the resin solidified layer on the upper surface of the upper slide plate. Happening.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a multi-chip integrated circuit packaging structure. Background technique [0002] The multi-chip integrated circuit packaging board is a finished product obtained by packaging integrated circuits of multiple chips. By melting resin and other materials used for integrated circuit packaging and covering the multi-chip integrated circuit, after the resin is air-dried and solidified, it can be To obtain a multi-chip integrated circuit package board with external pins, based on the above description, the inventors found that an existing multi-chip integrated circuit packaging structure mainly has the following deficiencies, for example: [0003] Since the pins of the multi-chip integrated circuit packaging board are vertically downward, and the resin will flow after melting, if the resin is covered with a large amount, it is easy for the molten resin flowing out ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/065H01L23/50
CPCH01L25/065H01L23/50
Inventor 李琴
Owner 深圳市好年华电子有限公司
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