Multi-chip integrated circuit packaging structure

Abstract

The invention discloses a multi-chip integrated circuit packaging structure which structurally comprises a fixing hole, an integrated circuit board and a clamping groove, the fixing hole is fixed to the position of the upper surface of the integrated circuit board, the integrated circuit board and the clamping groove are of an integrated structure, molten resin flowing downwards along pins can be collected through a collecting frame on the pins, the stress rods can generate upward reverse thrust on the upper sliding plate through reverse thrust generated by the platform on the stress rods on the pins, so that the upper sliding plate can slide upwards along the inner wall of the collecting frame, the upper sliding plate can push out the solidified branch layer in the collecting frame upwards, through collision generated by resetting of the upper sliding plate and the inner wall of the collecting frame, a top sliding rod can upwards slide and extend out along the frame under the cooperation of a sliding plate, so that an upper sliding plate can push up a resin solidification block on the upper surface of the frame, and the situation that an upper push rod cannot easily and effectively remove a resin solidification layer on the upper surface of the upper sliding plate is effectively avoided.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a multi-chip integrated circuit packaging structure. Background technique [0002] Multi-chip integrated circuit packaging board is a finished product obtained by packaging integrated circuits of multiple chips. After melting resin and other materials used for integrated circuit packaging and covering them on multi-chip integrated circuits, after the resin is air-dried and solidified, it can The multi-chip integrated circuit packaging board with pins outside is obtained. Based on the above description, the inventors found that the existing multi-chip integrated circuit packaging structure mainly has the following deficiencies, for example: [0003] Since the pins of the multi-chip integrated circuit packaging board are vertically downward, and the resin will flow after melting, if the resin coverage is large, it is easy for the molten resin to flow out to the...

AI Technical Summary

Problems solved by technology

[0003] Since the pins of the multi-chip integrated circuit packaging board are vertically downward, and the resin will flow after melting, if the resin coverage is large, it is easy for the molten resin to flow out to the edge to flow down along the pins to the bottom of the pin, resulting in unstable connection between the bottom of the pin and the circuit

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