Double-single-face PI copper-clad plate pressing and bonding device

Abstract

The invention relates to the technical field of copper-clad plates, and discloses a double-single-face PI copper-clad plate pressing and bonding device. The device comprises a shell, and the interior of the shell is fixedly connected with a fixing seat. Copper-clad plates are automatically fixed, the positions of the copper-clad plates are adjusted so that the copper-clad plates are placed in order, manual operation is omitted, the operation is convenient and fast, and the working efficiency is effectively improved. Follow-up overturning operation is triggered by means of position adjusting operation, linkage between structures is improved, and the automation degree is high. According to actual machining requirements, the placement position of a supporting plate is controlled, so that the supporting plate has a supporting effect on the copper-clad plates and facilitate hot pressing operation when being located at the highest point, and when the supporting plate is located at the lowest point, overturning operation is facilitated, the copper-clad plates are overturned by 180 degrees in a fixed state, and hot pressing on the other sides of the copper-clad plates is facilitated. Therefore, a double-side machining effect is achieved, various machining requirements can be met, and actual use conditions are better met.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a pressing and bonding device for double and single-sided PI copper clad laminates. Background technique [0002] Copper-clad laminate is a substrate used to install welding components in electronic circuits. During processing, it is an insulating board made of bakelite, fiber woven cloth and epoxy resin glue. One or both sides are covered with copper foil and hot-pressed. Made, often used in various electronic products. During the production of PI copper clad laminates, it needs to be operated on one or both sides according to the actual processing requirements. Usually, the plates are neatly placed at the bottom of the hot-pressing mechanism, and the hot-pressing mechanism is driven to process it. Due to the high temperature of the hot-pressing mechanism, in order to avoid burns, the staff need to wear heat-insulating gloves to operate, which is time-consuming an...

AI Technical Summary

Problems solved by technology

Usually, the plates are neatly placed on the bottom of the hot-pressing mechanism, and the hot-pressing mechanism is driven to process it. Due to the high temperature of the hot-pressing mechanism, in order to avoid burns, the staff need to wear heat-insulating gloves to operate, which is time-consuming and laborious.

In addition, the manual arrangement of the plates is easy to cause the arrangement of the plates to be irregular, which makes the hot pressing of the plates uneven and affects the hot pressing effect of the plates.

At the same time, the current bonding device cannot automatically process double-sided PI copper-clad laminates, and its use is relatively limited and cannot meet actual use needs.

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