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A hard board vcp high-efficiency electroplating device

An electroplating device and high-efficiency technology, applied in electrolytic components, electrolytic processes, cells, etc., can solve the problems of low work efficiency of hard board VCP electroplating, and achieve the effect of solving low work efficiency, improving work efficiency, and facilitating collection.

Active Publication Date: 2022-03-22
广东成功自动化设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a hard board VCP high-efficiency electroplating device to solve the technical problem of low work efficiency of hard board VCP electroplating in the prior art

Method used

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  • A hard board vcp high-efficiency electroplating device
  • A hard board vcp high-efficiency electroplating device
  • A hard board vcp high-efficiency electroplating device

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] The technical solutions provided by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028]An embodiment of the present invention provides a hard board VCP high-efficiency electroplating device including a workbench 1, a feeding device 2, a clamping device 3 and a feeding device ...

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Abstract

The invention discloses a hard board VCP high-efficiency electroplating device, belonging to the technical field of hard board VCP electroplating, comprising a workbench, a feeding device, a clamping device and a feeding device, the workbench is arranged horizontally, and the feeding device Set on the workbench, the clamping device is set on the side of the loading device, the unloading device is set under the clamping device, and the placed hard boards are loaded one by one through the set loading device , so that it is convenient for the clamping device to clamp the hard board, the hard board is clamped and electroplated by the clamping device provided, and the hard board after electroplating is collected by the provided blanking device, so as to solve the problem of hard board in the prior art The technical problem of low efficiency of plate VCP plating.

Description

technical field [0001] The invention relates to the technical field of hard board VCP electroplating, in particular to a hard board VCP high-efficiency electroplating device. Background technique [0002] VCP (Vertical conveyor plating), vertical continuous plating. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis, and the process of attaching a layer of metal film to the surface of metal or other material parts by electrolysis to prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) technical problem. Contents of the invention [0003] An embodiment of the present invention provides a hard board VCP high-efficiency electroplating device to solve the technical problem of low working efficiency of hard board VCP electroplating in the prior art. [0004] The embodiment of the prese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/06C25D21/00
CPCC25D17/06C25D21/00
Inventor 吴昱凯梁飞戴彬乔文举余仁水
Owner 广东成功自动化设备有限公司
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