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Mounting condition estimation device, learning device, and mounting condition estimation method

A technology for installing devices and learning devices, applied in the direction of electrical components, electrical components, etc.

Pending Publication Date: 2021-05-11
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since only the CAD data of the mounting board exists, only a part of the component information required for calculating the mounting conditions may be acquired, or only a part of the component information may be acquired at a different timing.

Method used

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  • Mounting condition estimation device, learning device, and mounting condition estimation method
  • Mounting condition estimation device, learning device, and mounting condition estimation method
  • Mounting condition estimation device, learning device, and mounting condition estimation method

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Embodiment Construction

[0062] In order to solve the above-mentioned problems, a mounting condition estimating device according to an aspect of the present disclosure estimates mounting conditions of a mounting device for mounting a component on a board, and includes: acquiring component parameters that are parameters related to the component A component information acquiring unit that is first component information that is a value of at least one component parameter; and an estimating unit that estimates a mounting condition based on the first component information acquired by the component information acquiring unit. For example, the parameter related to the part may include at least one of the size, shape, weight, appearance, type, surface state of the part, and a provision form for providing the part. In addition, the mounting condition may include at least one of information related to the type of the nozzle that sucks the component in the mounting device, the transfer, recognition, suction, and ...

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Abstract

The invention provides a mounting condition estimation device, a learning device, and a mounting condition estimation method. The present invention can estimate mounting conditions with high accuracy even with a small amount of information. A mounting condition estimation system (100) for estimating a mounting condition of a mounting device (200) for mounting a component (P) on a substrate (B), the mounting condition estimation system (100) being provided with: an information acquisition unit (108) for acquiring first component information, which is a value of at least one component parameter among component parameters that are parameters relating to the component (P); and an estimation unit (105) that estimates the mounting condition on the basis of the first component information acquired by the information acquisition unit (108).

Description

technical field [0001] The present disclosure relates to a device, a method, a program, and a learning device for estimating mounting conditions for mounting a component on a board by a mounting device. Background technique [0002] A mounting device for mounting a component on a substrate selects a nozzle that absorbs and holds the component based on mounting conditions corresponding to the size and weight of the component, and determines the speed at which the component is mounted on the substrate. In general, the mounting conditions correspond to identification information of each component mounted on the substrate. [0003] For example, in the technique described in Patent Document 1, the motion acceleration, which is one of the mounting conditions, is calculated based on information about the component and the type of suction nozzle that absorbs and holds the component. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: JP Unexamined ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/08
CPCH05K13/08H05K13/0882
Inventor 岩田维里清水太一
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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